Issued Patents All Time
Showing 25 most recent of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12294036 | Method for manufacturing monocrystalline silicon wafer containing arced side, method for manufacturing monocrystalline silicon cell, and photovoltaic module | Xiaolong Bai, Lizhu He, Xinyu Zhang, Peiyuan Wang, Ziyang Ou +3 more | 2025-05-06 |
| 11739436 | Apparatus and method for continuous crystal pulling | Weize Shang, Xiaolong Bai | 2023-08-29 |
| 11742453 | Method for manufacturing monocrystalline silicon wafer containing arced side, method for manufacturing monocrystalline silicon cell, and photovoltaic module | Xiaolong Bai, Lizhu He, Xinyu Zhang, Peiyuan Wang, Ziyang Ou +3 more | 2023-08-29 |
| 11719891 | Method of making a lensed connector with photosensitive glass | Nicholas Francis Borrelli, Davide Domenico Fortusini, Yu-Yen Huang, Shawn Michael O'Malley, Georges Roussos +2 more | 2023-08-08 |
| 11708643 | Method and apparatus for manufacturing monocrystalline silicon | Weize Shang, Xiaolong Bai | 2023-07-25 |
| 11631511 | Thermistor chip and preparation method thereof | Xiaohai Bai, Mengtian Yang, Limin Tang, Qixing Bai, Zhaoxiang Duan | 2023-04-18 |
| 10636550 | Composite thermistor chip and preparation method thereof | Zhaoxiang Duan, Jiankai Ye, Qixing Bai, Limin Tang | 2020-04-28 |
| 10330539 | High precision high reliability and quick response thermosensitive chip and manufacturing method thereof | Wenting Chen, Zhaoxiang Duan, Qixing Bai, Limin Tang, Jiankai Ye | 2019-06-25 |
| 9758673 | Polyamide molding compositions, molded parts obtained therefrom, and use thereof | Mok-Keun Lim, Hae Young Kim | 2017-09-12 |
| 9236356 | Semiconductor package with grounding and shielding layers | Sung Mook LIM | 2016-01-12 |
| 8882953 | Method for fabricating cliché, and method for forming thin film pattern by using the same | Yun-Ho Kook, Chul-Ho Kim, Sang Chul Jung, Jeong Hoon Lee, Nam-Kook Kim | 2014-11-11 |
| 8625814 | Earphone antenna of a portable terminal | Min-Won Cho, Byoung Hee Lee | 2014-01-07 |
| 8154111 | Near chip size semiconductor package | Sean T. Crowley, Angel Orabuena Alvarez | 2012-04-10 |
| 7833837 | Chip scale package and method for manufacturing the same | You Ock Joo, Dong Pil Jung | 2010-11-16 |
| 7700411 | Semiconductor device package and manufacturing method | You Ock Joo, Dong Pil Jung | 2010-04-20 |
| 7656047 | Semiconductor device package and manufacturing method | You Ock Joo, You Pil Jung | 2010-02-02 |
| 7633170 | Semiconductor device package and manufacturing method thereof | You Ock Joo, Dong Pil Jung | 2009-12-15 |
| 7439098 | Semiconductor package for encapsulating multiple dies and method of manufacturing the same | Tae-Seog Kim, You Ock Joo | 2008-10-21 |
| 7166917 | Semiconductor package having passive component disposed between semiconductor device and substrate | You Ock Joo, Dong Pil Jung | 2007-01-23 |
| 7146011 | Steering of directional sound beams | Woon Seng Gan, Meng Hwa Er, Chee Mun Kelvin Lee, Khim Sia Tan, Yew Hin Liew +3 more | 2006-12-05 |
| 7146106 | Optic semiconductor module and manufacturing method | Sang Ho Lee, Chul-Woo Park | 2006-12-05 |
| 7045396 | Stackable semiconductor package and method for manufacturing same | Sean T. Crowley, Angel Orabuena Alvarez | 2006-05-16 |
| 6995448 | Semiconductor package including passive elements and method of manufacture | Sang Ho Lee, Seon Goo Lee, Jong Hae Hyun, Choon Heung Lee | 2006-02-07 |
| 6879034 | Semiconductor package including low temperature co-fired ceramic substrate | Sun Goo Lee, Choon Heung Lee | 2005-04-12 |
| 6730544 | Stackable semiconductor package and method for manufacturing same | — | 2004-05-04 |