Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7833837 | Chip scale package and method for manufacturing the same | Jun Yang, Dong Pil Jung | 2010-11-16 |
| 7700411 | Semiconductor device package and manufacturing method | Jun Yang, Dong Pil Jung | 2010-04-20 |
| 7656047 | Semiconductor device package and manufacturing method | Jun Yang, You Pil Jung | 2010-02-02 |
| 7633170 | Semiconductor device package and manufacturing method thereof | Jun Yang, Dong Pil Jung | 2009-12-15 |
| 7439098 | Semiconductor package for encapsulating multiple dies and method of manufacturing the same | Jun Yang, Tae-Seog Kim | 2008-10-21 |
| 7166917 | Semiconductor package having passive component disposed between semiconductor device and substrate | Jun Yang, Dong Pil Jung | 2007-01-23 |