Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6919631 | Structures for improving heat dissipation in stacked semiconductor packages | Paul R. Hoffman | 2005-07-19 |
| 6737750 | Structures for improving heat dissipation in stacked semiconductor packages | Paul R. Hoffman | 2004-05-18 |
| 6650019 | Method of making a semiconductor package including stacked semiconductor dies | Thomas P. Glenn, Lee Smith, Kambhampati Ramakrishna, Vincent DiCaprio | 2003-11-18 |
| 6603072 | Making leadframe semiconductor packages with stacked dies and interconnecting interposer | Donald C. Foster | 2003-08-05 |
| 6472758 | Semiconductor package including stacked semiconductor dies and bond wires | Thomas P. Glenn, Lee Smith, Kambhampati Ramakrishna, Vincent DiCaprio | 2002-10-29 |