Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11840103 | Tapeless carrier for mechanically fixing tube-shaped objects | — | 2023-12-12 |
| 9367712 | High density memory card using folded flex | Jeffrey Alan Miks, Curtis Zwenger, Barry M. Miles | 2016-06-14 |
| 8129824 | Shielding for a semiconductor package | Roger D. St. Amand, Nozad Karim, Joseph Marco Longo, Robert Francis Darveaux, Jong Ok Chun +1 more | 2012-03-06 |
| 8089141 | Semiconductor package having leadframe with exposed anchor pads | — | 2012-01-03 |
| 8017436 | Thin substrate fabrication method and structure | Ronald Patrick Huemoeller, Sukianto Rusli, Bob Shih-Wei Kuo, Jon Aday, Robert Francis Darveaux | 2011-09-13 |
| 7842541 | Ultra thin package and fabrication method | Sukianto Rusli, Ronald Patrick Huemoeller, Bob Shih-Wei Kuo | 2010-11-30 |
| 7687893 | Semiconductor package having leadframe with exposed anchor pads | — | 2010-03-30 |
| 7268426 | High-frequency chip packages | Michael Warner, Belgacem Haba, Glenn Urbish, Masud Beroz, Teck-Gyu Kang | 2007-09-11 |
| 7176506 | High frequency chip packages with connecting elements | Masud Beroz, Michael Warner, Glenn Urbish, Teck-Gyu Kang, Jae M. Park +1 more | 2007-02-13 |
| D483628 | Food dicing device | — | 2003-12-16 |
| 6650019 | Method of making a semiconductor package including stacked semiconductor dies | Thomas P. Glenn, David Zoba, Kambhampati Ramakrishna, Vincent DiCaprio | 2003-11-18 |
| 6472758 | Semiconductor package including stacked semiconductor dies and bond wires | Thomas P. Glenn, David Zoba, Kambhampati Ramakrishna, Vincent DiCaprio | 2002-10-29 |
| D426641 | Body shaping device | — | 2000-06-13 |
| 5216922 | Slope monitoring device | Eric Gustafson, Jonathan P. Olson, Lyle V. Johnson | 1993-06-08 |