Lee Smith — 14 Patents at Amkor Technology

Lee Smith has been granted 14 US patents while listed as an inventor at Amkor Technology. The first was granted in 1993 and the most recent in December 2023. Lee Smith ranks #332,869 of 4,157,543 US inventors in our database (top 8.0%). Patent records list Lee Smith in Chandler, AZ, US.

Issued Patents All Time

Showing 1–14 of 14 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
11840103	Tapeless carrier for mechanically fixing tube-shaped objects	—	2023-12-12	$15,564,000
9367712	High density memory card using folded flex	Jeffrey Alan Miks, Curtis Zwenger, Barry M. Miles	2016-06-14	$8,294,000
8129824	Shielding for a semiconductor package	Roger D. St. Amand, Nozad Karim, Joseph Marco Longo, Robert Francis Darveaux, Jong Ok Chun +1 more	2012-03-06	$4,149,000
8089141	Semiconductor package having leadframe with exposed anchor pads	—	2012-01-03	$1,542,000
8017436	Thin substrate fabrication method and structure	Ronald Patrick Huemoeller, Sukianto Rusli, Bob Shih-Wei Kuo, Jon Aday, Robert Francis Darveaux	2011-09-13	$2,426,000
7842541	Ultra thin package and fabrication method	Sukianto Rusli, Ronald Patrick Huemoeller, Bob Shih-Wei Kuo	2010-11-30	$4,269,000
7687893	Semiconductor package having leadframe with exposed anchor pads	—	2010-03-30	$7,777,000
7268426	High-frequency chip packages	Michael Warner, Belgacem Haba, Glenn Urbish, Masud Beroz, Teck-Gyu Kang	2007-09-11	$6,705,000
7176506	High frequency chip packages with connecting elements	Masud Beroz, Michael Warner, Glenn Urbish, Teck-Gyu Kang, Jae M. Park +1 more	2007-02-13	$8,077,000
D483628	Food dicing device	—	2003-12-16
6650019	Method of making a semiconductor package including stacked semiconductor dies	Thomas P. Glenn, David Zoba, Kambhampati Ramakrishna, Vincent DiCaprio	2003-11-18	$51,827,000
6472758	Semiconductor package including stacked semiconductor dies and bond wires	Thomas P. Glenn, David Zoba, Kambhampati Ramakrishna, Vincent DiCaprio	2002-10-29	$8,024,000
D426641	Body shaping device	—	2000-06-13
5216922	Slope monitoring device	Eric Gustafson, Jonathan P. Olson, Lyle V. Johnson	1993-06-08

Lee Smith — 14 Patents

Issued Patents All Time

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