Issued Patents All Time
Showing 25 most recent of 26 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10327076 | Top port MEMS package and method | Ahmer Syed, Louis B. Troche, Jr. | 2019-06-18 |
| 9776855 | Reversible top/bottom MEMS package | David Bolognia, Bud Troche | 2017-10-03 |
| 9758372 | MEMS package with MEMS die, magnet, and window substrate fabrication method and structure | Shaun Bowers, Russell Shumway | 2017-09-12 |
| 9670445 | Microfluidics sensor package fabrication method and structure | Russell Shumway | 2017-06-06 |
| 9420378 | Top port MEMS microphone package and method | Ahmer Syed, Louis B. Troche, Jr. | 2016-08-16 |
| 9359191 | Reversible top/bottom MEMS package | David Bolognia, Bud Troche | 2016-06-07 |
| 9162871 | Metal mesh lid MEMS package and method | Russell Shumway, Louis B. Troche, Jr. | 2015-10-20 |
| 9013011 | Stacked and staggered die MEMS package and method | Brett Dunlap, Louis B. Troche, Jr., Ahmer Syed, Russell Shumway | 2015-04-21 |
| 8981537 | Reversible top/bottom MEMS package | David Bolognia, Bud Troche | 2015-03-17 |
| 8866004 | Frame interconnect for concentrated photovoltaic module | SungSun Park | 2014-10-21 |
| 8866002 | Through wafer via structures for concentrated photovoltaic cells | Garry Pycroft, Frederick Evans Reed | 2014-10-21 |
| 8809677 | Molded light guide for concentrated photovoltaic receiver module | — | 2014-08-19 |
| 8680656 | Leadframe structure for concentrated photovoltaic receiver package | John M. Nickelsen, Jr., Timothy L. Olson | 2014-03-25 |
| 8671565 | Blind via capture pad structure fabrication method | — | 2014-03-18 |
| 8552517 | Conductive paste and mold for electrical connection of photovoltaic die to substrate | Giuseppe Selli, Michael DeVita | 2013-10-08 |
| 8535961 | Light emitting diode (LED) package and method | Brett Dunlap, David Bolognia | 2013-09-17 |
| 8536663 | Metal mesh lid MEMS package and method | Russell Shumway, Louis B. Troche, Jr. | 2013-09-17 |
| 8354747 | Conductive polymer lid for a sensor package and method therefor | — | 2013-01-15 |
| 8217507 | Edge mount semiconductor package | Jesse E. Galloway, Ahmer Syed | 2012-07-10 |
| 8115283 | Reversible top/bottom MEMS package | David Bolognia, Bud Troche | 2012-02-14 |
| 8030722 | Reversible top/bottom MEMS package | David Bolognia, Bud Troche | 2011-10-04 |
| 8017436 | Thin substrate fabrication method and structure | Ronald Patrick Huemoeller, Sukianto Rusli, Jon Aday, Lee Smith, Robert Francis Darveaux | 2011-09-13 |
| 7915715 | System and method to provide RF shielding for a MEMS microphone package | Nozad Karim, Jingkun Mao | 2011-03-29 |
| 7842541 | Ultra thin package and fabrication method | Sukianto Rusli, Ronald Patrick Huemoeller, Lee Smith | 2010-11-30 |
| 7750250 | Blind via capture pad structure | — | 2010-07-06 |