Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12368088 | Jet impingement cooling for high power semiconductor devices | — | 2025-07-22 |
| 12002736 | Jet impingement cooling for high power semiconductor devices | — | 2024-06-04 |
| 11600550 | Jet impingement cooling for high power semiconductor devices | — | 2023-03-07 |
| 9892990 | Semiconductor package lid thermal interface material standoffs | Paul Mescher | 2018-02-13 |
| 8217507 | Edge mount semiconductor package | Bob Shih-Wei Kuo, Ahmer Syed | 2012-07-10 |
| 7906845 | Semiconductor device having reduced thermal interface material (TIM) degradation and method therefor | Sasanka Laxmi Narasimha Kanuparthi | 2011-03-15 |
| 6444563 | Method and apparatus for extending fatigue life of solder joints in a semiconductor device | Scott G. Potter, Joseph G. Gillette, Zane Eric Johnson, Pradeep Lall | 2002-09-03 |
| 5689403 | Intercooled electronic device | William H. Robertson, Jr., David E. Reiff, Richard A. Ceraldi, Sivakumar Muthuswamy, Craig K. Gygi +2 more | 1997-11-18 |