Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Jet impingement cooling for high power semiconductor devices

Jet impingement cooling for high power semiconductor devices

US Patent 12002736 · Granted Jun 4, 2024

Estimated economic value: $98,629,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Jet impingement cooling for high power semiconductor devices2025
Jet impingement cooling for high power semiconductor devices2023
Semiconductor package lid thermal interface material standoffs2018
Edge mount semiconductor package2012
Semiconductor device having reduced thermal interface material (TIM) degradation2011
Method and apparatus for extending fatigue life of solder joints in a semiconduc2002
Intercooled electronic device1997