Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method and apparatus for extending fatigue life of solder joints in a semiconductor device

Method and apparatus for extending fatigue life of solder joints in a semiconductor device

US Patent 6444563 · Granted Sep 3, 2002

Estimated economic value: $16,155,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Jet impingement cooling for high power semiconductor devices2025
Jet impingement cooling for high power semiconductor devices2024
Jet impingement cooling for high power semiconductor devices2023
Device for clearing liquid from an audio transducer2020
Method to generate a sound illusion profile to replicate a quantity of resources2019
Semiconductor package lid thermal interface material standoffs2018
Edge mount semiconductor package2012
Semiconductor device having reduced thermal interface material (TIM) degradation2011
Electronic device with user interface capability and method therefor2005
Electronic device with user interface capability and method therefor2005
Method of pre-caching user interaction elements using input device position2002
Surface mount flexible interconnect and component carrier2001