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Paul Mescher

IBM: 4 patents #21,733 of 70,183Top 35%
AT Amkor Technology: 2 patents #266 of 595Top 45%
AP Amkor Technology Singapore Holding Pte.: 2 patents #154 of 289Top 55%
Overall (All Time): #623,402 of 4,157,543Top 15%
8
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
11848275 Integrated shield package and method Danny Brady 2023-12-19
10886235 Integrated shield package and method Danny Brady 2021-01-05
10109591 Integrated shield package and method Danny Brady 2018-10-23
9892990 Semiconductor package lid thermal interface material standoffs Jesse E. Galloway 2018-02-13
6821814 Method for joining a semiconductor chip to a chip carrier substrate and resulting chip package William Rena LaFontaine, Jr., Charles G. Woychik 2004-11-23
6294828 Semiconductor chip package William Rena LaFontaine, Jr., Charles G. Woychik 2001-09-25
6162660 Method for joining a semiconductor chip to a chip carrier substrate and resulting chip package William Rena LaFontaine, Jr., Charles G. Woychik 2000-12-19
6130476 Semiconductor chip package having chip-to-carrier mechanical/electrical connection formed via solid state diffusion William Rena LaFontaine, Jr., Charles G. Woychik 2000-10-10