Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
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Paul Mescher — 8 Patents

IBM: 4 patents #21,783 of 70,183Top 35%
ATAmkor Technology: 2 patents #266 of 595Top 45%
APAmkor Technology Singapore Holding Pte.: 2 patents #154 of 289Top 55%
Chandler, AZ: #700 of 3,331 inventorsTop 25%
Arizona: #4,629 of 32,909 inventorsTop 15%
Overall (All Time): #600,572 of 4,157,543Top 15%
8 Patents All Time
Paul Mescher has been granted 8 US patents while listed as an inventor at IBM. The first was granted in 2000 and the most recent in December 2023. Paul Mescher ranks #600,572 of 4,157,543 US inventors in our database (top 14.4%). Patent records list Paul Mescher in Chandler, AZ, US.

Patents per Year

Patents granted per year, 2000 to 2023Bar chart with a peak of 2 patents in 2000.peak 22000: 2 patents20002001: 1 patents20012004: 1 patents20042018: 2 patents20182021: 1 patents20212023: 1 patents2023

Issued Patents All Time

Showing 1–8 of 8 patents

Patent #TitleCo-InventorsDateApprox Value ⓘ
11848275 Integrated shield package and method Danny Brady 2023-12-19 $23,258,000
10886235 Integrated shield package and method Danny Brady 2021-01-05 $51,239,000
10109591 Integrated shield package and method Danny Brady 2018-10-23 $11,274,000
9892990 Semiconductor package lid thermal interface material standoffs Jesse E. Galloway 2018-02-13 $18,845,000
6821814 Method for joining a semiconductor chip to a chip carrier substrate and resulting chip package William Rena LaFontaine, Jr., Charles G. Woychik 2004-11-23 $4,043,000
6294828 Semiconductor chip package William Rena LaFontaine, Jr., Charles G. Woychik 2001-09-25 $32,998,000
6162660 Method for joining a semiconductor chip to a chip carrier substrate and resulting chip package William Rena LaFontaine, Jr., Charles G. Woychik 2000-12-19 $38,646,000
6130476 Semiconductor chip package having chip-to-carrier mechanical/electrical connection formed via solid state diffusion William Rena LaFontaine, Jr., Charles G. Woychik 2000-10-10 $63,451,000