Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6821814 | Method for joining a semiconductor chip to a chip carrier substrate and resulting chip package | Paul Mescher, Charles G. Woychik | 2004-11-23 |
| 6294828 | Semiconductor chip package | Paul Mescher, Charles G. Woychik | 2001-09-25 |
| 6162660 | Method for joining a semiconductor chip to a chip carrier substrate and resulting chip package | Paul Mescher, Charles G. Woychik | 2000-12-19 |
| 6130476 | Semiconductor chip package having chip-to-carrier mechanical/electrical connection formed via solid state diffusion | Paul Mescher, Charles G. Woychik | 2000-10-10 |