| 12040305 |
Shielded electronic component package |
Jong Ok Chun, Nozad Karim, Richard Chen, Michael Kelly |
2024-07-16 |
| 11646290 |
Shielded electronic component package |
Jong Ok Chun, Nozad Karim, Richard Chen, Michael Kelly |
2023-05-09 |
| 11031366 |
Shielded electronic component package |
Jong Ok Chun, Nozad Karim, Richard Chen, Michael Kelly |
2021-06-08 |
| 10424556 |
Shielded electronic component package |
Jong Ok Chun, Nozad Karim, Richard Chen, Michael Kelly |
2019-09-24 |
| 9433117 |
Shield lid interconnect package and method |
Jong Ok Chun, Nozad Karim, Richard Chen, Michael Kelly |
2016-08-30 |
| 8552517 |
Conductive paste and mold for electrical connection of photovoltaic die to substrate |
Michael DeVita, Bob Shih-Wei Kuo |
2013-10-08 |
| 8199518 |
Top feature package and method |
Jong Ok Chun, Nozad Karim, Richard Chen, Michael Kelly |
2012-06-12 |