Issued Patents All Time
Showing 25 most recent of 161 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12345934 | Methods for fabrication of optical structures on photonic glass layer substrates | Paul Meissner, Anup Pancholi | 2025-07-01 |
| 12183594 | Semiconductor device with tiered pillar and manufacturing method thereof | Michael Kelly, Curtis Zwenger | 2024-12-31 |
| 12159823 | Semiconductor package with front side and back side redistribution structures and fabricating method thereof | Michael Kelly, David Jon Hiner, Roger D. St. Amand | 2024-12-03 |
| 12136565 | Semiconductor device package and manufacturing method thereof | Michael Kelly, Won Chul Do, David Jon Hiner | 2024-11-05 |
| 11915949 | Hybrid panel method of manufacturing electronic devices and electronic devices manufactured thereby | Bora Baloglu, Suresh Jayaraman, Andre Cardoso, Eoin O'Toole, Marta Sa Santos +4 more | 2024-02-27 |
| 11901335 | Semiconductor package with routing patch and conductive interconnection structures laterally displaced from routing patch | Michael Kelly, David Jon Hiner | 2024-02-13 |
| 11881471 | Semiconductor device and manufacturing method thereof | — | 2024-01-23 |
| 11848214 | Encapsulated semiconductor package | Sukianto Rusli, David Jon Hiner | 2023-12-19 |
| 11823913 | Method of manufacturing an electronic device and electronic device manufactured thereby | Bora Baloglu, Curtis Zwenger | 2023-11-21 |
| 11676941 | Semiconductor package and fabricating method thereof | David Jon Hiner, Michael Kelly, In Su Mok, Sang Hyoun Lee, Won Chul Do +1 more | 2023-06-13 |
| 11652038 | Semiconductor package with front side and back side redistribution structures and fabricating method thereof | Michael Kelly, David Jon Hiner, Roger D. St. Amand | 2023-05-16 |
| 11605552 | Hybrid panel method of manufacturing electronic devices and electronic devices manufactured thereby | Bora Baloglu, Suresh Jayaraman, Andre Cardoso, Eoin O'Toole | 2023-03-14 |
| 11545405 | Packaging for fingerprint sensors and methods of manufacture | David Bolognia, Robert Francis Darveaux, Brett Dunlap | 2023-01-03 |
| 11424155 | Semiconductor device package and manufacturing method thereof | Michael Kelly, Won Chul Do, David Jon Hiner | 2022-08-23 |
| 11335643 | Embedded ball land substrate, semiconductor package, and manufacturing methods | Corey Reichman | 2022-05-17 |
| 11289451 | Semiconductor package with high routing density patch | Michael Kelly, David Jon Hiner | 2022-03-29 |
| 11244923 | Semiconductor device and manufacturing method thereof | — | 2022-02-08 |
| 11094560 | Encapsulated semiconductor package | Sukianto Rusli, David Jon Hiner | 2021-08-17 |
| 11081370 | Methods of manufacturing an encapsulated semiconductor device | Sukianto Rusli, David Jon Hiner | 2021-08-03 |
| 11031259 | Method of manufacturing an electronic device and electronic device manufactured thereby | Bora Baloglu, Curtis Zwenger | 2021-06-08 |
| 11031256 | Semiconductor device with tiered pillar and manufacturing method thereof | Michael Kelly, Curtis Zwenger | 2021-06-08 |
| 10943858 | Semiconductor package and fabricating method thereof | Michael Kelly, David Jon Hiner, Roger D. St. Amand | 2021-03-09 |
| 10818602 | Embedded ball land substrate, semiconductor package, and manufacturing methods | Corey Reichman | 2020-10-27 |
| 10811277 | Encapsulated semiconductor package | Sukianto Rusli, David Jon Hiner | 2020-10-20 |
| 10790161 | Electronic device with adaptive vertical interconnect and fabricating method thereof | Bora Baloglu, Curtis Zwenger | 2020-09-29 |