Issued Patents All Time
Showing 26–50 of 161 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10784232 | Semiconductor package and fabricating method thereof | David Jon Hiner, Michael Kelly | 2020-09-22 |
| 10748786 | Semiconductor device with tiered pillar and manufacturing method thereof | Michael Kelly, Curtis Zwenger | 2020-08-18 |
| 10714378 | Semiconductor device package and manufacturing method thereof | Michael Kelly, Won Chul Do, David Jon Hiner | 2020-07-14 |
| 10672740 | Semiconductor package with high routing density patch | Michael Kelly, David Jon Hiner | 2020-06-02 |
| 10665567 | Wafer level package and fabrication method | Sukianto Rusli, David Razu | 2020-05-26 |
| 10636717 | Packaging for fingerprint sensors and methods of manufacture | David Bolognia, Robert Francis Darveaux, Brett Dunlap | 2020-04-28 |
| RE47890 | Packaging for fingerprint sensors and methods of manufacture | David Bolognia, Robert Francis Darveaux, Brett Dunlap | 2020-03-03 |
| 10504871 | Semiconductor device and manufacturing method thereof | — | 2019-12-10 |
| 10497674 | Semiconductor package and fabricating method thereof | David Jon Hiner, Michael Kelly | 2019-12-03 |
| 10468272 | Method of manufacturing an electronic device and electronic device manufactured thereby | Bora Baloglu, Curtis Zwenger | 2019-11-05 |
| 10461006 | Encapsulated semiconductor package | Sukianto Rusli, David Jon Hiner | 2019-10-29 |
| 10312220 | Semiconductor package and fabricating method thereof | David Jon Hiner, Michael Kelly | 2019-06-04 |
| 10283400 | Semiconductor device package and manufacturing method thereof | Michael Kelly, Won Chul Do, David Jon Hiner | 2019-05-07 |
| 10256114 | Semiconductor device with tiered pillar and manufacturing method thereof | Michael Kelly, Curtis Zwenger | 2019-04-09 |
| 10192816 | Semiconductor package and fabricating method thereof | Michael Kelly, David Jon Hiner, Roger D. St. Amand | 2019-01-29 |
| 10134635 | Stress relieving through-silicon vias | Bora Baloglu | 2018-11-20 |
| 10128194 | Trace stacking structure and method | David Jon Hiner, Harry Donald McCaleb, III, Michael DeVita | 2018-11-13 |
| 10090234 | Semiconductor device package and manufacturing method thereof | Michael Kelly, Won Chul Do, David Jon Hiner | 2018-10-02 |
| 10074630 | Semiconductor package with high routing density patch | Michael Kelly, David Jon Hiner | 2018-09-11 |
| 10032748 | Semiconductor package and fabricating method thereof | David Jon Hiner, Michael Kelly | 2018-07-24 |
| 10014240 | Embedded component package and fabrication method | Michael Kelly, David Jon Hiner | 2018-07-03 |
| 9966300 | Semiconductor device package and manufacturing method thereof | Michael Kelly, Won Chul Do, David Jon Hiner | 2018-05-08 |
| 9905440 | Method of manufacturing an electronic device and electronic device manufactured thereby | Bora Baloglu, Curtis Zwenger | 2018-02-27 |
| 9871015 | Wafer level package and fabrication method | Sukianto Rusli, David Razu | 2018-01-16 |
| 9852976 | Semiconductor package and fabricating method thereof | Michael Kelly, David Jon Hiner, Roger D. St. Amand | 2017-12-26 |