Issued Patents All Time
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10665567 | Wafer level package and fabrication method | Ronald Patrick Huemoeller, Sukianto Rusli | 2020-05-26 |
| 9871015 | Wafer level package and fabrication method | Ronald Patrick Huemoeller, Sukianto Rusli | 2018-01-16 |
| 9406645 | Wafer level package and fabrication method | Ronald Patrick Huemoeller, Sukianto Rusli | 2016-08-02 |
| 9054117 | Wafer level package and fabrication method | Ronald Patrick Huemoeller, Sukianto Rusli | 2015-06-09 |
| 8952522 | Wafer level package and fabrication method | Ronald Patrick Huemoeller, Sukianto Rusli | 2015-02-10 |
| 8710649 | Wafer level package and fabrication method | Ronald Patrick Huemoeller, Sukianto Rusli | 2014-04-29 |
| 8691632 | Wafer level package and fabrication method | Ronald Patrick Huemoeller, Sukianto Rusli | 2014-04-08 |
| 8486764 | Wafer level package and fabrication method | Ronald Patrick Huemoeller, Sukianto Rusli | 2013-07-16 |
| 8298866 | Wafer level package and fabrication method | Ronald Patrick Huemoeller, Sukianto Rusli | 2012-10-30 |
| 8119455 | Wafer level package fabrication method | Ronald Patrick Huemoeller, Sukianto Rusli | 2012-02-21 |
| 7932595 | Electronic component package comprising fan-out traces | Ronald Patrick Huemoeller, Sukianto Rusli | 2011-04-26 |
| 7714431 | Electronic component package comprising fan-out and fan-in traces | Ronald Patrick Huemoeller, Sukianto Rusli | 2010-05-11 |
| 7192807 | Wafer level package and fabrication method | Ronald Patrick Huemoeller, Sukianto Rusli | 2007-03-20 |
| 6905914 | Wafer level package and fabrication method | Ronald Patrick Huemoeller, Sukianto Rusli | 2005-06-14 |
| 6309916 | Method of molding plastic semiconductor packages | Sean T. Crowley, Gerald L. Cheney | 2001-10-30 |
| 5381042 | Packaged integrated circuit including heat slug having an exposed surface | Steve Lerner | 1995-01-10 |