DR

David Razu

AT Amkor Technology: 15 patents #40 of 595Top 7%
AE Amkor Electronics: 1 patents #12 of 35Top 35%
Overall (All Time): #295,209 of 4,157,543Top 8%
16
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
10665567 Wafer level package and fabrication method Ronald Patrick Huemoeller, Sukianto Rusli 2020-05-26
9871015 Wafer level package and fabrication method Ronald Patrick Huemoeller, Sukianto Rusli 2018-01-16
9406645 Wafer level package and fabrication method Ronald Patrick Huemoeller, Sukianto Rusli 2016-08-02
9054117 Wafer level package and fabrication method Ronald Patrick Huemoeller, Sukianto Rusli 2015-06-09
8952522 Wafer level package and fabrication method Ronald Patrick Huemoeller, Sukianto Rusli 2015-02-10
8710649 Wafer level package and fabrication method Ronald Patrick Huemoeller, Sukianto Rusli 2014-04-29
8691632 Wafer level package and fabrication method Ronald Patrick Huemoeller, Sukianto Rusli 2014-04-08
8486764 Wafer level package and fabrication method Ronald Patrick Huemoeller, Sukianto Rusli 2013-07-16
8298866 Wafer level package and fabrication method Ronald Patrick Huemoeller, Sukianto Rusli 2012-10-30
8119455 Wafer level package fabrication method Ronald Patrick Huemoeller, Sukianto Rusli 2012-02-21
7932595 Electronic component package comprising fan-out traces Ronald Patrick Huemoeller, Sukianto Rusli 2011-04-26
7714431 Electronic component package comprising fan-out and fan-in traces Ronald Patrick Huemoeller, Sukianto Rusli 2010-05-11
7192807 Wafer level package and fabrication method Ronald Patrick Huemoeller, Sukianto Rusli 2007-03-20
6905914 Wafer level package and fabrication method Ronald Patrick Huemoeller, Sukianto Rusli 2005-06-14
6309916 Method of molding plastic semiconductor packages Sean T. Crowley, Gerald L. Cheney 2001-10-30
5381042 Packaged integrated circuit including heat slug having an exposed surface Steve Lerner 1995-01-10