Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12429988 | Fingerprint sensor and button combinations and methods of making same | Paul Wickboldt | 2025-09-30 |
| 11829565 | Fingerprint sensor and button combinations and methods of making same | Paul Wickboldt | 2023-11-28 |
| 11545405 | Packaging for fingerprint sensors and methods of manufacture | Ronald Patrick Huemoeller, David Bolognia, Robert Francis Darveaux | 2023-01-03 |
| 11119615 | Fingerprint sensor and button combinations and methods of making same | Paul Wickboldt | 2021-09-14 |
| 10636717 | Packaging for fingerprint sensors and methods of manufacture | Ronald Patrick Huemoeller, David Bolognia, Robert Francis Darveaux | 2020-04-28 |
| RE47890 | Packaging for fingerprint sensors and methods of manufacture | Ronald Patrick Huemoeller, David Bolognia, Robert Francis Darveaux | 2020-03-03 |
| 10546833 | Method of forming a plurality of electronic component packages | — | 2020-01-28 |
| 10338754 | Edge-effect mitigation for capacitive sensors | Guozhong Shen, Ozan E. Erdogan, Shengmin Wen | 2019-07-02 |
| 10325132 | Fingerprint sensor and button combinations and methods of making same | Paul Wickboldt | 2019-06-18 |
| 10055631 | Semiconductor package for sensor applications | Shengmin Wen, Jay Eunjae Kim | 2018-08-21 |
| 9754852 | Packaging for fingerprint sensors and methods of manufacture | Ronald Patrick Huemoeller, David Bolognia, Robert Francis Darveaux | 2017-09-05 |
| 9691734 | Method of forming a plurality of electronic component packages | — | 2017-06-27 |
| 9651513 | Fingerprint sensor and button combinations and methods of making same | Paul Wickboldt | 2017-05-16 |
| 9013011 | Stacked and staggered die MEMS package and method | Bob Shih-Wei Kuo, Louis B. Troche, Jr., Ahmer Syed, Russell Shumway | 2015-04-21 |
| 8941250 | Electronic component package fabrication method and structure | Robert Francis Darveaux, Ronald Patrick Huemoeller | 2015-01-27 |
| 8937381 | Thin stackable package and method | Alexander William Copia | 2015-01-20 |
| 8791501 | Integrated passive device structure and method | Ruben Fuentes | 2014-07-29 |
| 8753730 | Mechanical tape separation package | Robert Francis Darveaux | 2014-06-17 |
| 8653674 | Electronic component package fabrication method and structure | Robert Francis Darveaux, Ronald Patrick Huemoeller | 2014-02-18 |
| 8535961 | Light emitting diode (LED) package and method | Bob Shih-Wei Kuo, David Bolognia | 2013-09-17 |
| 8432022 | Shielded embedded electronic component substrate fabrication method and structure | Ronald Patrick Huemoeller, David Jon Hiner | 2013-04-30 |
| 8337657 | Mechanical tape separation package and method | Robert Francis Darveaux | 2012-12-25 |