Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8937381 | Thin stackable package and method | Brett Dunlap | 2015-01-20 |
| 8836115 | Stacked inverted flip chip package and fabrication method | Roger D. St. Amand, August Joseph Miller, Jr., KwangSeok Oh | 2014-09-16 |
| 7755176 | Die-mounting substrate and method incorporating dummy traces for improving mounting film planarity | Roger D. St. Amand, Chang Suk Han, Wan Wook Ko | 2010-07-13 |
| 6201305 | Making solder ball mounting pads on substrates | Robert Francis Darveaux, Barry M. Miles | 2001-03-13 |