Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9449890 | Methods for temporary bussing of semiconductor package substrates | Johnnie Quan, Kurt Raab, Jeffery Alan Miks | 2016-09-20 |
| 9061884 | Integrated circuit with efficient MEMS architecture | Johnnie Quan | 2015-06-23 |
| 8946886 | Shielded electronic component package and method | Ruben Fuentes | 2015-02-03 |
| 8836115 | Stacked inverted flip chip package and fabrication method | Roger D. St. Amand, Alexander William Copia, KwangSeok Oh | 2014-09-16 |
| 7960827 | Thermal via heat spreader package and method | Jeffrey Alan Miks, Christopher M. Scanlan, Mahmoud Dreiza | 2011-06-14 |