Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9449890 | Methods for temporary bussing of semiconductor package substrates | August Joseph Miller, Jr., Kurt Raab, Jeffery Alan Miks | 2016-09-20 |
| 9061884 | Integrated circuit with efficient MEMS architecture | August Joseph Miller, Jr. | 2015-06-23 |