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Methods for temporary bussing of semiconductor package substrates |
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2016-09-20 |
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Apparatus for processing flexible tape for microelectronic assemblies |
Joseph Link |
2004-02-10 |
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Transferable resilient element for packaging of a semiconductor chip and method therefor |
John W. Smith |
2004-02-03 |
| 6309910 |
Microelectronic components with frangible lead sections |
Belgacem Haba |
2001-10-30 |
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Methods of making compliant interfaces and microelectronic packages using same |
— |
2001-10-09 |
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Transferable resilient element for packaging of a semiconductor chip and method therefor |
John W. Smith |
2001-09-25 |
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Universal unit strip/carrier frame assembly and methods |
Joseph Link |
2001-01-09 |
| 6049972 |
Universal unit strip/carrier frame assembly and methods |
Joseph Link |
2000-04-18 |
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Multiple part compliant interface for packaging of a semiconductor chip and method therefor |
Thomas Pickett, Thomas H. Di Stefano |
1999-06-22 |
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Multi-layer tab tape having distinct signal, power and ground planes, semiconductor device assembly employing same, apparatus for and method of assembling same |
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| 5801432 |
Electronic system using multi-layer tab tape semiconductor device having distinct signal, power and ground planes |
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1998-09-01 |
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G-tab manufacturing process and the product produced thereby |
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1992-04-28 |
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G-TAB having particular through hole |
Craig A. Foster, Randolfo Galvez |
1991-11-12 |
