Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8129824 | Shielding for a semiconductor package | Roger D. St. Amand, Nozad Karim, Lee Smith, Robert Francis Darveaux, Jong Ok Chun +1 more | 2012-03-06 |
| 7825520 | Stacked redistribution layer (RDL) die assembly package | Christopher M. Scanlan | 2010-11-02 |
| 7550857 | Stacked redistribution layer (RDL) die assembly package | Christopher M. Scanlan | 2009-06-23 |