| 11855023 |
Wafer level fan out semiconductor device and manufacturing method thereof |
Boo Yang Jung, Jong Sik Paek, Choon Heung Lee, Sang Won Kim, Sung Kyu Kim +1 more |
2023-12-26 |
| 10903181 |
Wafer level fan out semiconductor device and manufacturing method thereof |
Boo Yang Jung, Jong Sik Paek, Choon Heung Lee, Sang Won Kim, Sung Kyu Kim +1 more |
2021-01-26 |
| 10483222 |
Semiconductor device and manufacturing method thereof |
Jong Sik Paek, Eun Sook Sohn, Won Chul Do, Glenn Rinne |
2019-11-19 |
| 9748154 |
Wafer level fan out semiconductor device and manufacturing method thereof |
Boo Yang Jung, Jong Sik Paek, Choon Heung Lee, Sang Won Kim, Sung Kyu Kim +1 more |
2017-08-29 |
| 9653336 |
Semiconductor device and manufacturing method thereof |
Yi Seul Han, Jae Beum Shim, Byong Jin Kim |
2017-05-16 |
| 9543235 |
Semiconductor package and method therefor |
Hyung Il Jeon, Ji Young Chung, Byong Jin Kim, Jae Min Bae, No Sun Park |
2017-01-10 |
| 9524906 |
Semiconductor device and manufacturing method thereof |
Jong Sik Paek, Eun Sook Sohn, Won Chul Do, Glenn Rinne |
2016-12-20 |
| 9504525 |
Handpiece laser treatment apparatus capable of adjusting length of optical fiber |
— |
2016-11-29 |
| 9343427 |
Manufacturing method of semiconductor device and semiconductor device manufactured thereby |
Jin Seong Kim, Kwang Seok Oh |
2016-05-17 |
| 9190370 |
Semiconductor device utilizing redistribution layers to couple stacked die |
Jong Sik Paek, Doo Hyun Park, Won Chul Do, Pil Je Sung, Jin-Hee Park +4 more |
2015-11-17 |
| 9184148 |
Semiconductor package and method therefor |
Hyung Il Jeon, Ji Young Chung, Byong Jin Kim, Jae Min Bae, No Sun Park |
2015-11-10 |
| 9048241 |
Semiconductor device utilzing redistribution layers to couple stacked die |
Jong Sik Paek, Doo Hyun Park, Seong Min Seo, Won Chul Do, Pil Je Sung +5 more |
2015-06-02 |
| 8446017 |
Stackable wafer level package and fabricating method thereof |
Jong Sik Paek, Chang Deok Lee |
2013-05-21 |
| 8362612 |
Semiconductor device and manufacturing method thereof |
Jong Sik Paek, Eun Sook Sohn, Won Chul Do, Glenn Rinne |
2013-01-29 |
| 6987319 |
Wafer-level chip-scale package |
Jong Sik Paek, Seong Min Seo |
2006-01-17 |
| 6841874 |
Wafer-level chip-scale package |
Jong Sik Paek, Seong Min Seo |
2005-01-11 |
| 6589801 |
Wafer-scale production of chip-scale semiconductor packages using wafer mapping techniques |
Ju Hoon Yoon, Dae Byung Kang, Vincent DiCaprio, Markus K. Liebhard |
2003-07-08 |