Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9871011 | Semiconductor package using a contact in a pleated sidewall encapsulant opening | Jae Yun Kim, Tae Kyung Hwang, Jin Han Kim, Jong Sik Paek, Kyoung Rock Kim +1 more | 2018-01-16 |
| 9716071 | Semiconductor device redistribution layer with narrow trace width relative to passivation layer opening | Ji Yeon Ryu, Byong Jin Kim | 2017-07-25 |
| 9704747 | Semiconductor device and manufacturing method thereof | Ji Yeon Ryu, Byong Jin Kim | 2017-07-11 |
| 9653336 | Semiconductor device and manufacturing method thereof | Yi Seul Han, Byong Jin Kim, In Bae Park | 2017-05-16 |