Issued Patents All Time
Showing 25 most recent of 49 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12388049 | High connectivity device stacking | Kurtis Leschkies, Steven Verhaverbeke, Giback Park, Kyuil Cho, Jeffrey L. Franklin +1 more | 2025-08-12 |
| 12374611 | Package core assembly and fabrication methods | Steven Verhaverbeke, Giback Park, Kyuil Cho, Kurtis Leschkies, Roman Gouk +4 more | 2025-07-29 |
| 12354968 | Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration | Steven Verhaverbeke, Guan Huei See, Giback Park, Giorgio Cellere, Diego Tonini +2 more | 2025-07-08 |
| 12087679 | Package core assembly and fabrication methods | Steven Verhaverbeke, Giback Park, Kyuil Cho, Kurtis Leschkies, Roman Gouk +4 more | 2024-09-10 |
| 11931855 | Planarization methods for packaging substrates | Steven Verhaverbeke, Tapash Chakraborty, Prayudi Lianto, Prerna Goradia, Giback Park +3 more | 2024-03-19 |
| 11887934 | Package structure and fabrication methods | Steven Verhaverbeke, Giback Park, Giorgio Cellere, Diego Tonini, Vincent DiCaprio +1 more | 2024-01-30 |
| 11881447 | Package core assembly and fabrication methods | Steven Verhaverbeke, Giback Park, Kyuil Cho, Kurtis Leschkies, Roman Gouk +4 more | 2024-01-23 |
| 11862546 | Package core assembly and fabrication methods | Steven Verhaverbeke, Giback Park, Kyuil Cho, Kurtis Leschkies, Roman Gouk +2 more | 2024-01-02 |
| 11837680 | Substrate structuring methods | Steven Verhaverbeke, Giback Park | 2023-12-05 |
| 11798831 | Method for substrate registration and anchoring in inkjet printing | Daihua Zhang, Hou T. Ng, Nag B. Patibandla, Sivapackia Ganapathiappan, Yingdong Luo +1 more | 2023-10-24 |
| 11742330 | High connectivity device stacking | Kurtis Leschkies, Steven Verhaverbeke, Giback Park, Kyuil Cho, Jeffrey L. Franklin +1 more | 2023-08-29 |
| 11715700 | Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration | Steven Verhaverbeke, Guan Huei See, Giback Park, Giorgio Cellere, Diego Tonini +2 more | 2023-08-01 |
| 11705365 | Methods of micro-via formation for advanced packaging | Wei-Sheng Lei, Kurtis Leschkies, Roman Gouk, Giback Park, Kyuil Cho +2 more | 2023-07-18 |
| 11676832 | Laser ablation system for package fabrication | Kurtis Leschkies, Jeffrey L. Franklin, Wei-Sheng Lei, Steven Verhaverbeke, Jean Delmas +1 more | 2023-06-13 |
| 11521937 | Package structures with built-in EMI shielding | Steven Verhaverbeke, Giback Park, Chintan Buch | 2022-12-06 |
| 11521935 | Package structure and fabrication methods | Steven Verhaverbeke, Giback Park, Giorgio Cellere, Diego Tonini, Vincent DiCaprio +1 more | 2022-12-06 |
| 11476202 | Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration | Steven Verhaverbeke, Guan Huei See, Giback Park, Giorgio Cellere, Diego Tonini +2 more | 2022-10-18 |
| 11424137 | Drying process for high aspect ratio features | Roman Gouk, Steven Verhaverbeke, Jean Delmas | 2022-08-23 |
| 11400545 | Laser ablation for package fabrication | Kurtis Leschkies, Wei-Sheng Lei, Jeffrey L. Franklin, Jean Delmas, Giback Park +1 more | 2022-08-02 |
| 11398433 | Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration | Steven Verhaverbeke, Guan Huei See, Giback Park, Giorgio Cellere, Diego Tonini +2 more | 2022-07-26 |
| 11388822 | Methods for improved polymer-copper adhesion | Tapash Chakraborty, Steven Verhaverbeke, Chintan Buch, Prerna Goradia, Giback Park +1 more | 2022-07-12 |
| 11367643 | Method for substrate registration and anchoring in inkjet printing | Daihua Zhang, Hou T. Ng, Nag B. Patibandla, Sivapackia Ganapathiappan, Yingdong Luo +1 more | 2022-06-21 |
| 11362235 | Substrate structuring methods | Steven Verhaverbeke, Giback Park | 2022-06-14 |
| 11342256 | Method of fine redistribution interconnect formation for advanced packaging applications | Steven Verhaverbeke, Kyuil Cho, Prayudi Lianto, Guan Huei See, Vincent DiCaprio | 2022-05-24 |
| 11329003 | Anchoring dies using 3D printing to form reconstructed wafer | Daihua Zhang, Hou T. Ng, Nag B. Patibandla, Sivapackia Ganapathiappan, Yingdong Luo +1 more | 2022-05-10 |