Issued Patents All Time
Showing 26–49 of 49 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11322381 | Method for substrate registration and anchoring in inkjet printing | Daihua Zhang, Hou T. Ng, Nag B. Patibandla, Sivapackia Ganapathiappan, Yingdong Luo +1 more | 2022-05-03 |
| 11281094 | Method for via formation by micro-imprinting | Roman Gouk, Giback Park, Kyuil Cho, Chintan Buch, Steven Verhaverbeke +1 more | 2022-03-22 |
| 11264333 | Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration | Steven Verhaverbeke, Guan Huei See, Giback Park, Giorgio Cellere, Diego Tonini +2 more | 2022-03-01 |
| 11264331 | Package structure and fabrication methods | Steven Verhaverbeke, Giback Park, Giorgio Cellere, Diego Tonini, Vincent DiCaprio +1 more | 2022-03-01 |
| 11257790 | High connectivity device stacking | Kurtis Leschkies, Steven Verhaverbeke, Giback Park, Kyuil Cho, Jeffrey L. Franklin +1 more | 2022-02-22 |
| 11133174 | Reduced volume processing chamber | Roman Gouk, Steven Verhaverbeke, Jean Delmas | 2021-09-28 |
| 11063169 | Substrate structuring methods | Steven Verhaverbeke, Giback Park | 2021-07-13 |
| 11011392 | Stiction-free drying process with contaminant removal for high-aspect ratio semiconductor device structures | Steven Verhaverbeke, Roman Gouk | 2021-05-18 |
| 10937726 | Package structure with embedded core | Steven Verhaverbeke, Giback Park, Kyuil Cho, Kurtis Leschkies, Roman Gouk +2 more | 2021-03-02 |
| 10886232 | Package structure and fabrication methods | Steven Verhaverbeke, Giback Park, Giorgio Cellere, Diego Tonini, Vincent DiCaprio +1 more | 2021-01-05 |
| 10777405 | Drying process for high aspect ratio features | Roman Gouk, Steven Verhaverbeke, Jean Delmas | 2020-09-15 |
| 10727083 | Method for via formation in flowable epoxy materials by micro-imprint | Roman Gouk, Chintan Buch, Kyuil Cho, Steven Verhaverbeke, Vincent DiCaprio | 2020-07-28 |
| 10573510 | Substrate support and baffle apparatus | Roman Gouk, Steven Verhaverbeke, Jean Delmas | 2020-02-25 |
| 10354892 | Stiction-free drying process with contaminant removal for high-aspect ratio semiconductor device structures | Steven Verhaverbeke, Roman Gouk | 2019-07-16 |
| 10347511 | Stiction-free drying process with contaminant removal for high-aspect ratio semiconductor device STR | Steven Verhaverbeke, Roman Gouk | 2019-07-09 |
| 10304703 | Small thermal mass pressurized chamber | Roman Gouk, Steven Verhaverbeke, Jean Delmas | 2019-05-28 |
| 10283344 | Supercritical carbon dioxide process for low-k thin films | Steven Verhaverbeke, Roman Gouk, Kurtis Leschkies | 2019-05-07 |
| 10229827 | Method of redistribution layer formation for advanced packaging applications | Steven Verhaverbeke, Roman Gouk, Guan Huei See, Yu Gu, Arvind Sundarrajan | 2019-03-12 |
| 10211072 | Method of reconstituted substrate formation for advanced packaging applications | Steven Verhaverbeke, Roman Gouk, Guan Huei See, Yu Gu, Arvind Sundarrajan +3 more | 2019-02-19 |
| 10032624 | Substrate support and baffle apparatus | Roman Gouk, Steven Verhaverbeke, Jean Delmas | 2018-07-24 |
| 8530356 | Method of BARC removal in semiconductor device manufacturing | Roman Gouk, Steven Verhaverbeke | 2013-09-10 |
| 7914623 | Post-ion implant cleaning for silicon on insulator substrate preparation | James S. Papanu, Brian J. Brown, Steven Verhaverbeke | 2011-03-29 |
| 7718009 | Cleaning submicron structures on a semiconductor wafer surface | Steven Verhaverbeke, Jianshe Tang, Roman Gouk, Brian J. Brown, Ching-Hwa Weng +2 more | 2010-05-18 |
| 7432177 | Post-ion implant cleaning for silicon on insulator substrate preparation | James S. Papanu, Brian J. Brown, Steven Verhaverbeke | 2008-10-07 |