Issued Patents All Time
Showing 25 most recent of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12388049 | High connectivity device stacking | Kurtis Leschkies, Han-Wen Chen, Steven Verhaverbeke, Kyuil Cho, Jeffrey L. Franklin +1 more | 2025-08-12 |
| 12374611 | Package core assembly and fabrication methods | Han-Wen Chen, Steven Verhaverbeke, Kyuil Cho, Kurtis Leschkies, Roman Gouk +4 more | 2025-07-29 |
| 12354968 | Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration | Han-Wen Chen, Steven Verhaverbeke, Guan Huei See, Giorgio Cellere, Diego Tonini +2 more | 2025-07-08 |
| 12087679 | Package core assembly and fabrication methods | Han-Wen Chen, Steven Verhaverbeke, Kyuil Cho, Kurtis Leschkies, Roman Gouk +4 more | 2024-09-10 |
| 11931855 | Planarization methods for packaging substrates | Han-Wen Chen, Steven Verhaverbeke, Tapash Chakraborty, Prayudi Lianto, Prerna Goradia +3 more | 2024-03-19 |
| 11887934 | Package structure and fabrication methods | Han-Wen Chen, Steven Verhaverbeke, Giorgio Cellere, Diego Tonini, Vincent DiCaprio +1 more | 2024-01-30 |
| 11881447 | Package core assembly and fabrication methods | Han-Wen Chen, Steven Verhaverbeke, Kyuil Cho, Kurtis Leschkies, Roman Gouk +4 more | 2024-01-23 |
| 11862546 | Package core assembly and fabrication methods | Han-Wen Chen, Steven Verhaverbeke, Kyuil Cho, Kurtis Leschkies, Roman Gouk +2 more | 2024-01-02 |
| 11837680 | Substrate structuring methods | Han-Wen Chen, Steven Verhaverbeke | 2023-12-05 |
| 11742330 | High connectivity device stacking | Kurtis Leschkies, Han-Wen Chen, Steven Verhaverbeke, Kyuil Cho, Jeffrey L. Franklin +1 more | 2023-08-29 |
| 11715700 | Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration | Han-Wen Chen, Steven Verhaverbeke, Guan Huei See, Giorgio Cellere, Diego Tonini +2 more | 2023-08-01 |
| 11705365 | Methods of micro-via formation for advanced packaging | Wei-Sheng Lei, Kurtis Leschkies, Roman Gouk, Kyuil Cho, Tapash Chakraborty +2 more | 2023-07-18 |
| 11676832 | Laser ablation system for package fabrication | Kurtis Leschkies, Jeffrey L. Franklin, Wei-Sheng Lei, Steven Verhaverbeke, Jean Delmas +1 more | 2023-06-13 |
| 11521937 | Package structures with built-in EMI shielding | Steven Verhaverbeke, Han-Wen Chen, Chintan Buch | 2022-12-06 |
| 11521935 | Package structure and fabrication methods | Han-Wen Chen, Steven Verhaverbeke, Giorgio Cellere, Diego Tonini, Vincent DiCaprio +1 more | 2022-12-06 |
| 11476202 | Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration | Han-Wen Chen, Steven Verhaverbeke, Guan Huei See, Giorgio Cellere, Diego Tonini +2 more | 2022-10-18 |
| 11400545 | Laser ablation for package fabrication | Kurtis Leschkies, Wei-Sheng Lei, Jeffrey L. Franklin, Jean Delmas, Han-Wen Chen +1 more | 2022-08-02 |
| 11398433 | Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration | Han-Wen Chen, Steven Verhaverbeke, Guan Huei See, Giorgio Cellere, Diego Tonini +2 more | 2022-07-26 |
| 11388822 | Methods for improved polymer-copper adhesion | Tapash Chakraborty, Steven Verhaverbeke, Han-Wen Chen, Chintan Buch, Prerna Goradia +1 more | 2022-07-12 |
| 11362235 | Substrate structuring methods | Han-Wen Chen, Steven Verhaverbeke | 2022-06-14 |
| 11281094 | Method for via formation by micro-imprinting | Roman Gouk, Kyuil Cho, Han-Wen Chen, Chintan Buch, Steven Verhaverbeke +1 more | 2022-03-22 |
| 11264331 | Package structure and fabrication methods | Han-Wen Chen, Steven Verhaverbeke, Giorgio Cellere, Diego Tonini, Vincent DiCaprio +1 more | 2022-03-01 |
| 11264333 | Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration | Han-Wen Chen, Steven Verhaverbeke, Guan Huei See, Giorgio Cellere, Diego Tonini +2 more | 2022-03-01 |
| 11257790 | High connectivity device stacking | Kurtis Leschkies, Han-Wen Chen, Steven Verhaverbeke, Kyuil Cho, Jeffrey L. Franklin +1 more | 2022-02-22 |
| 11063169 | Substrate structuring methods | Han-Wen Chen, Steven Verhaverbeke | 2021-07-13 |