| 12388049 |
High connectivity device stacking |
Kurtis Leschkies, Han-Wen Chen, Steven Verhaverbeke, Kyuil Cho, Jeffrey L. Franklin +1 more |
2025-08-12 |
|
| 12374611 |
Package core assembly and fabrication methods |
Han-Wen Chen, Steven Verhaverbeke, Kyuil Cho, Kurtis Leschkies, Roman Gouk +4 more |
2025-07-29 |
|
| 12354968 |
Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration |
Han-Wen Chen, Steven Verhaverbeke, Guan Huei See, Giorgio Cellere, Diego Tonini +2 more |
2025-07-08 |
|
| 12087679 |
Package core assembly and fabrication methods |
Han-Wen Chen, Steven Verhaverbeke, Kyuil Cho, Kurtis Leschkies, Roman Gouk +4 more |
2024-09-10 |
|
| 11931855 |
Planarization methods for packaging substrates |
Han-Wen Chen, Steven Verhaverbeke, Tapash Chakraborty, Prayudi Lianto, Prerna Goradia +3 more |
2024-03-19 |
$54,086,000 |
| 11887934 |
Package structure and fabrication methods |
Han-Wen Chen, Steven Verhaverbeke, Giorgio Cellere, Diego Tonini, Vincent DiCaprio +1 more |
2024-01-30 |
$39,141,000 |
| 11881447 |
Package core assembly and fabrication methods |
Han-Wen Chen, Steven Verhaverbeke, Kyuil Cho, Kurtis Leschkies, Roman Gouk +4 more |
2024-01-23 |
$48,508,000 |
| 11862546 |
Package core assembly and fabrication methods |
Han-Wen Chen, Steven Verhaverbeke, Kyuil Cho, Kurtis Leschkies, Roman Gouk +2 more |
2024-01-02 |
$40,045,000 |
| 11837680 |
Substrate structuring methods |
Han-Wen Chen, Steven Verhaverbeke |
2023-12-05 |
$45,995,000 |
| 11742330 |
High connectivity device stacking |
Kurtis Leschkies, Han-Wen Chen, Steven Verhaverbeke, Kyuil Cho, Jeffrey L. Franklin +1 more |
2023-08-29 |
$78,061,000 |
| 11715700 |
Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration |
Han-Wen Chen, Steven Verhaverbeke, Guan Huei See, Giorgio Cellere, Diego Tonini +2 more |
2023-08-01 |
$66,604,000 |
| 11705365 |
Methods of micro-via formation for advanced packaging |
Wei-Sheng Lei, Kurtis Leschkies, Roman Gouk, Kyuil Cho, Tapash Chakraborty +2 more |
2023-07-18 |
$58,990,000 |
| 11676832 |
Laser ablation system for package fabrication |
Kurtis Leschkies, Jeffrey L. Franklin, Wei-Sheng Lei, Steven Verhaverbeke, Jean Delmas +1 more |
2023-06-13 |
$42,513,000 |
| 11521937 |
Package structures with built-in EMI shielding |
Steven Verhaverbeke, Han-Wen Chen, Chintan Buch |
2022-12-06 |
$44,170,000 |
| 11521935 |
Package structure and fabrication methods |
Han-Wen Chen, Steven Verhaverbeke, Giorgio Cellere, Diego Tonini, Vincent DiCaprio +1 more |
2022-12-06 |
$44,170,000 |
| 11476202 |
Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration |
Han-Wen Chen, Steven Verhaverbeke, Guan Huei See, Giorgio Cellere, Diego Tonini +2 more |
2022-10-18 |
$26,737,000 |
| 11400545 |
Laser ablation for package fabrication |
Kurtis Leschkies, Wei-Sheng Lei, Jeffrey L. Franklin, Jean Delmas, Han-Wen Chen +1 more |
2022-08-02 |
$46,822,000 |
| 11398433 |
Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration |
Han-Wen Chen, Steven Verhaverbeke, Guan Huei See, Giorgio Cellere, Diego Tonini +2 more |
2022-07-26 |
$63,545,000 |
| 11388822 |
Methods for improved polymer-copper adhesion |
Tapash Chakraborty, Steven Verhaverbeke, Han-Wen Chen, Chintan Buch, Prerna Goradia +1 more |
2022-07-12 |
$30,931,000 |
| 11362235 |
Substrate structuring methods |
Han-Wen Chen, Steven Verhaverbeke |
2022-06-14 |
$21,647,000 |
| 11281094 |
Method for via formation by micro-imprinting |
Roman Gouk, Kyuil Cho, Han-Wen Chen, Chintan Buch, Steven Verhaverbeke +1 more |
2022-03-22 |
$64,102,000 |
| 11264331 |
Package structure and fabrication methods |
Han-Wen Chen, Steven Verhaverbeke, Giorgio Cellere, Diego Tonini, Vincent DiCaprio +1 more |
2022-03-01 |
$41,046,000 |
| 11264333 |
Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration |
Han-Wen Chen, Steven Verhaverbeke, Guan Huei See, Giorgio Cellere, Diego Tonini +2 more |
2022-03-01 |
$41,046,000 |
| 11257790 |
High connectivity device stacking |
Kurtis Leschkies, Han-Wen Chen, Steven Verhaverbeke, Kyuil Cho, Jeffrey L. Franklin +1 more |
2022-02-22 |
$169,194,000 |
| 11063169 |
Substrate structuring methods |
Han-Wen Chen, Steven Verhaverbeke |
2021-07-13 |
$86,517,000 |
