High connectivity device stacking

Assignee

• Applied Materials

Inventors

• Kurtis Leschkies (35 patents)
• Han-Wen Chen (49 patents)
• Steven Verhaverbeke (136 patents)
• Giback Park (29 patents)
• Kyuil Cho (32 patents)
• Jeffrey L. Franklin (12 patents)
• Wei-Sheng Lei (107 patents)

View full patent text on Google Patents →