Planarization methods for packaging substrates

Assignee

• Applied Materials

Inventors

• Han-Wen Chen (49 patents)
• Steven Verhaverbeke (136 patents)
• Tapash Chakraborty (12 patents)
• Prayudi Lianto (17 patents)
• Prerna Goradia (43 patents)
• Giback Park (29 patents)
• Chintan Buch (15 patents)
• Pin Gian Gan (2 patents)
• Alex Hung (1 patents)

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