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Home › Methods of micro-via formation for advanced packaging

Methods of micro-via formation for advanced packaging

US Patent 11705365 · Granted Jul 18, 2023

Estimated economic value: $58,990,000 ⓘ

Assignee

Applied Materials

Inventors

Wei-Sheng Lei (107 patents)
Kurtis Leschkies (35 patents)
Roman Gouk (49 patents)
Giback Park (29 patents)
Kyuil Cho (32 patents)
Tapash Chakraborty (12 patents)
Han-Wen Chen (49 patents)
Steven Verhaverbeke (136 patents)

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