| 12374611 |
Package core assembly and fabrication methods |
Han-Wen Chen, Steven Verhaverbeke, Giback Park, Kyuil Cho, Kurtis Leschkies +4 more |
2025-07-29 |
|
| 12358073 |
Method and apparatus for laser drilling blind vias |
Wei-Sheng Lei, Kurtis Leschkies, Steven Verhaverbeke, Visweswaren Sivaramakrishnan |
2025-07-15 |
|
| 12087679 |
Package core assembly and fabrication methods |
Han-Wen Chen, Steven Verhaverbeke, Giback Park, Kyuil Cho, Kurtis Leschkies +4 more |
2024-09-10 |
|
| 11927885 |
Fluoropolymer stamp fabrication method |
Jean Delmas, Steven Verhaverbeke, Chintan Buch |
2024-03-12 |
$97,620,000 |
| 11881447 |
Package core assembly and fabrication methods |
Han-Wen Chen, Steven Verhaverbeke, Giback Park, Kyuil Cho, Kurtis Leschkies +4 more |
2024-01-23 |
$48,508,000 |
| 11862546 |
Package core assembly and fabrication methods |
Han-Wen Chen, Steven Verhaverbeke, Giback Park, Kyuil Cho, Kurtis Leschkies +2 more |
2024-01-02 |
$40,045,000 |
| 11798903 |
Methods of forming microvias with reduced diameter |
Chintan Buch, Steven Verhaverbeke |
2023-10-24 |
$34,065,000 |
| 11705365 |
Methods of micro-via formation for advanced packaging |
Wei-Sheng Lei, Kurtis Leschkies, Giback Park, Kyuil Cho, Tapash Chakraborty +2 more |
2023-07-18 |
$58,990,000 |
| 11454884 |
Fluoropolymer stamp fabrication method |
Jean Delmas, Steven Verhaverbeke, Chintan Buch |
2022-09-27 |
$38,581,000 |
| 11424137 |
Drying process for high aspect ratio features |
Han-Wen Chen, Steven Verhaverbeke, Jean Delmas |
2022-08-23 |
$37,610,000 |
| 11315890 |
Methods of forming microvias with reduced diameter |
Chintan Buch, Steven Verhaverbeke |
2022-04-26 |
$43,127,000 |
| 11281094 |
Method for via formation by micro-imprinting |
Giback Park, Kyuil Cho, Han-Wen Chen, Chintan Buch, Steven Verhaverbeke +1 more |
2022-03-22 |
$64,102,000 |
| 11232951 |
Method and apparatus for laser drilling blind vias |
Wei-Sheng Lei, Kurtis Leschkies, Steven Verhaverbeke, Visweswaren Sivaramakrishnan |
2022-01-25 |
$92,631,000 |
| 11133174 |
Reduced volume processing chamber |
Han-Wen Chen, Steven Verhaverbeke, Jean Delmas |
2021-09-28 |
$64,178,000 |
| 11011392 |
Stiction-free drying process with contaminant removal for high-aspect ratio semiconductor device structures |
Steven Verhaverbeke, Han-Wen Chen |
2021-05-18 |
$51,490,000 |
| 10937726 |
Package structure with embedded core |
Han-Wen Chen, Steven Verhaverbeke, Giback Park, Kyuil Cho, Kurtis Leschkies +2 more |
2021-03-02 |
$62,769,000 |
| 10879116 |
Method for copper plating through silicon vias using wet wafer back contact |
Steven Verhaverbeke |
2020-12-29 |
$47,583,000 |
| 10777405 |
Drying process for high aspect ratio features |
Han-Wen Chen, Steven Verhaverbeke, Jean Delmas |
2020-09-15 |
$35,161,000 |
| 10727083 |
Method for via formation in flowable epoxy materials by micro-imprint |
Chintan Buch, Kyuil Cho, Han-Wen Chen, Steven Verhaverbeke, Vincent DiCaprio |
2020-07-28 |
$35,855,000 |
| 10573510 |
Substrate support and baffle apparatus |
Han-Wen Chen, Steven Verhaverbeke, Jean Delmas |
2020-02-25 |
$22,337,000 |
| 10354892 |
Stiction-free drying process with contaminant removal for high-aspect ratio semiconductor device structures |
Steven Verhaverbeke, Han-Wen Chen |
2019-07-16 |
$26,330,000 |
| 10347511 |
Stiction-free drying process with contaminant removal for high-aspect ratio semiconductor device STR |
Steven Verhaverbeke, Han-Wen Chen |
2019-07-09 |
$20,979,000 |
| 10304703 |
Small thermal mass pressurized chamber |
Han-Wen Chen, Steven Verhaverbeke, Jean Delmas |
2019-05-28 |
$34,437,000 |
| 10283344 |
Supercritical carbon dioxide process for low-k thin films |
Steven Verhaverbeke, Han-Wen Chen, Kurtis Leschkies |
2019-05-07 |
$13,988,000 |
| 10233538 |
Demagnetization of magnetic media by C doping for HDD patterned media application |
Martin A. Hilkene, Matthew D. Scotney-Castle, Peter I. Porshnev |
2019-03-19 |
$17,059,000 |
