Issued Patents All Time
Showing 25 most recent of 49 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12374611 | Package core assembly and fabrication methods | Han-Wen Chen, Steven Verhaverbeke, Giback Park, Kyuil Cho, Kurtis Leschkies +4 more | 2025-07-29 |
| 12358073 | Method and apparatus for laser drilling blind vias | Wei-Sheng Lei, Kurtis Leschkies, Steven Verhaverbeke, Visweswaren Sivaramakrishnan | 2025-07-15 |
| 12087679 | Package core assembly and fabrication methods | Han-Wen Chen, Steven Verhaverbeke, Giback Park, Kyuil Cho, Kurtis Leschkies +4 more | 2024-09-10 |
| 11927885 | Fluoropolymer stamp fabrication method | Jean Delmas, Steven Verhaverbeke, Chintan Buch | 2024-03-12 |
| 11881447 | Package core assembly and fabrication methods | Han-Wen Chen, Steven Verhaverbeke, Giback Park, Kyuil Cho, Kurtis Leschkies +4 more | 2024-01-23 |
| 11862546 | Package core assembly and fabrication methods | Han-Wen Chen, Steven Verhaverbeke, Giback Park, Kyuil Cho, Kurtis Leschkies +2 more | 2024-01-02 |
| 11798903 | Methods of forming microvias with reduced diameter | Chintan Buch, Steven Verhaverbeke | 2023-10-24 |
| 11705365 | Methods of micro-via formation for advanced packaging | Wei-Sheng Lei, Kurtis Leschkies, Giback Park, Kyuil Cho, Tapash Chakraborty +2 more | 2023-07-18 |
| 11454884 | Fluoropolymer stamp fabrication method | Jean Delmas, Steven Verhaverbeke, Chintan Buch | 2022-09-27 |
| 11424137 | Drying process for high aspect ratio features | Han-Wen Chen, Steven Verhaverbeke, Jean Delmas | 2022-08-23 |
| 11315890 | Methods of forming microvias with reduced diameter | Chintan Buch, Steven Verhaverbeke | 2022-04-26 |
| 11281094 | Method for via formation by micro-imprinting | Giback Park, Kyuil Cho, Han-Wen Chen, Chintan Buch, Steven Verhaverbeke +1 more | 2022-03-22 |
| 11232951 | Method and apparatus for laser drilling blind vias | Wei-Sheng Lei, Kurtis Leschkies, Steven Verhaverbeke, Visweswaren Sivaramakrishnan | 2022-01-25 |
| 11133174 | Reduced volume processing chamber | Han-Wen Chen, Steven Verhaverbeke, Jean Delmas | 2021-09-28 |
| 11011392 | Stiction-free drying process with contaminant removal for high-aspect ratio semiconductor device structures | Steven Verhaverbeke, Han-Wen Chen | 2021-05-18 |
| 10937726 | Package structure with embedded core | Han-Wen Chen, Steven Verhaverbeke, Giback Park, Kyuil Cho, Kurtis Leschkies +2 more | 2021-03-02 |
| 10879116 | Method for copper plating through silicon vias using wet wafer back contact | Steven Verhaverbeke | 2020-12-29 |
| 10777405 | Drying process for high aspect ratio features | Han-Wen Chen, Steven Verhaverbeke, Jean Delmas | 2020-09-15 |
| 10727083 | Method for via formation in flowable epoxy materials by micro-imprint | Chintan Buch, Kyuil Cho, Han-Wen Chen, Steven Verhaverbeke, Vincent DiCaprio | 2020-07-28 |
| 10573510 | Substrate support and baffle apparatus | Han-Wen Chen, Steven Verhaverbeke, Jean Delmas | 2020-02-25 |
| 10354892 | Stiction-free drying process with contaminant removal for high-aspect ratio semiconductor device structures | Steven Verhaverbeke, Han-Wen Chen | 2019-07-16 |
| 10347511 | Stiction-free drying process with contaminant removal for high-aspect ratio semiconductor device STR | Steven Verhaverbeke, Han-Wen Chen | 2019-07-09 |
| 10304703 | Small thermal mass pressurized chamber | Han-Wen Chen, Steven Verhaverbeke, Jean Delmas | 2019-05-28 |
| 10283344 | Supercritical carbon dioxide process for low-k thin films | Steven Verhaverbeke, Han-Wen Chen, Kurtis Leschkies | 2019-05-07 |
| 10233538 | Demagnetization of magnetic media by C doping for HDD patterned media application | Martin A. Hilkene, Matthew D. Scotney-Castle, Peter I. Porshnev | 2019-03-19 |