| 12424446 |
Silicon (Si) dry etch for die-to-wafer thinning |
Guan Huei See, ChangBum YONG, Cheng-ko J. Sun, Arvind Sundarrajan |
2025-09-23 |
| 12138742 |
Methods and apparatus for processing a substrate |
Guan Huei See, Arvind Sundarrajan, Andrivo RUSYDI, Muhammad Avicenna Naradipa |
2024-11-12 |
| 12020992 |
Methods and apparatus for processing a substrate |
Guan Huei See, Arvind Sundarrajan, Muhammad Avicenna Naradipa, Andrivo RUSYDI |
2024-06-25 |
| 11931855 |
Planarization methods for packaging substrates |
Han-Wen Chen, Steven Verhaverbeke, Tapash Chakraborty, Prerna Goradia, Giback Park +3 more |
2024-03-19 |
| 11901225 |
Diffusion layers in metal interconnects |
Eric J. Bergman, John L. Klocke, Marvin L. Bernt |
2024-02-13 |
| 11899376 |
Methods for forming alignment marks |
Liu Jiang, Marvin L. Bernt, El Mehdi Bazizi, Guan Huei See |
2024-02-13 |
| 11421316 |
Methods and apparatus for controlling warpage in wafer level packaging processes |
Mohamed Rafi, Muhammad Azim Bin Syed Sulaiman, Guan Huei See, Ang Yu Xin Kristy, Karthik Elumalai +2 more |
2022-08-23 |
| 11355358 |
Methods of thinning silicon on epoxy mold compound for radio frequency (RF) applications |
Guan Huei See, Yu Gu |
2022-06-07 |
| 11342256 |
Method of fine redistribution interconnect formation for advanced packaging applications |
Han-Wen Chen, Steven Verhaverbeke, Kyuil Cho, Guan Huei See, Vincent DiCaprio |
2022-05-24 |
| 11309278 |
Methods for bonding substrates |
Guan Huei See, Sriskantharajah Thirunavukarasu, Arvind Sundarrajan, Xundong Dai, Peter Khai Mum Fung |
2022-04-19 |
| 11289387 |
Methods and apparatus for backside via reveal processing |
Sik Hin Chi, SHIH-CHAO HUNG, Pin Gian Gan, Ricardo Fujii Vinluan, Gaurav Mehta +10 more |
2022-03-29 |
| 10636696 |
Methods for forming vias in polymer layers |
Yu Gu, Guan Huei See, Peng Suo, Arvind Sundarrajan |
2020-04-28 |
| 10515927 |
Methods and apparatus for semiconductor package processing |
Guan Huei See, Arvind Sundarrajan, Ranga Rao Arnepalli, Prerna Goradia |
2019-12-24 |
| 10319601 |
Slurry for polishing of integrated circuit packaging |
Ranga Rao Arnepalli, Prerna Goradia, Jie Zeng, Arvind Sundarrajan, Robert Jan Visser +1 more |
2019-06-11 |
| 10002771 |
Methods for chemical mechanical polishing (CMP) processing with ozone |
Kuma Hsiung, Eric J. Bergman, John L. Klocke, Mohamed Rafi, MUHAMMAD AZIM +2 more |
2018-06-19 |
| 9922874 |
Methods of enhancing polymer adhesion to copper |
Sam Lee, Charles Sharbono, Marvin L. Bernt, Guan Huei See, Arvind Sundarrajan |
2018-03-20 |
