Issued Patents All Time
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424446 | Silicon (Si) dry etch for die-to-wafer thinning | Guan Huei See, ChangBum YONG, Cheng-ko J. Sun, Arvind Sundarrajan | 2025-09-23 |
| 12138742 | Methods and apparatus for processing a substrate | Guan Huei See, Arvind Sundarrajan, Andrivo RUSYDI, Muhammad Avicenna Naradipa | 2024-11-12 |
| 12020992 | Methods and apparatus for processing a substrate | Guan Huei See, Arvind Sundarrajan, Muhammad Avicenna Naradipa, Andrivo RUSYDI | 2024-06-25 |
| 11931855 | Planarization methods for packaging substrates | Han-Wen Chen, Steven Verhaverbeke, Tapash Chakraborty, Prerna Goradia, Giback Park +3 more | 2024-03-19 |
| 11901225 | Diffusion layers in metal interconnects | Eric J. Bergman, John L. Klocke, Marvin L. Bernt | 2024-02-13 |
| 11899376 | Methods for forming alignment marks | Liu Jiang, Marvin L. Bernt, El Mehdi Bazizi, Guan Huei See | 2024-02-13 |
| 11421316 | Methods and apparatus for controlling warpage in wafer level packaging processes | Mohamed Rafi, Muhammad Azim Bin Syed Sulaiman, Guan Huei See, Ang Yu Xin Kristy, Karthik Elumalai +2 more | 2022-08-23 |
| 11355358 | Methods of thinning silicon on epoxy mold compound for radio frequency (RF) applications | Guan Huei See, Yu Gu | 2022-06-07 |
| 11342256 | Method of fine redistribution interconnect formation for advanced packaging applications | Han-Wen Chen, Steven Verhaverbeke, Kyuil Cho, Guan Huei See, Vincent DiCaprio | 2022-05-24 |
| 11309278 | Methods for bonding substrates | Guan Huei See, Sriskantharajah Thirunavukarasu, Arvind Sundarrajan, Xundong Dai, Peter Khai Mum Fung | 2022-04-19 |
| 11289387 | Methods and apparatus for backside via reveal processing | Sik Hin Chi, SHIH-CHAO HUNG, Pin Gian Gan, Ricardo Fujii Vinluan, Gaurav Mehta +10 more | 2022-03-29 |
| 10636696 | Methods for forming vias in polymer layers | Yu Gu, Guan Huei See, Peng Suo, Arvind Sundarrajan | 2020-04-28 |
| 10515927 | Methods and apparatus for semiconductor package processing | Guan Huei See, Arvind Sundarrajan, Ranga Rao Arnepalli, Prerna Goradia | 2019-12-24 |
| 10319601 | Slurry for polishing of integrated circuit packaging | Ranga Rao Arnepalli, Prerna Goradia, Jie Zeng, Arvind Sundarrajan, Robert Jan Visser +1 more | 2019-06-11 |
| 10002771 | Methods for chemical mechanical polishing (CMP) processing with ozone | Kuma Hsiung, Eric J. Bergman, John L. Klocke, Mohamed Rafi, MUHAMMAD AZIM +2 more | 2018-06-19 |
| 9922874 | Methods of enhancing polymer adhesion to copper | Sam Lee, Charles Sharbono, Marvin L. Bernt, Guan Huei See, Arvind Sundarrajan | 2018-03-20 |