Issued Patents All Time
Showing 1–25 of 35 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12068159 | Methods and apparatus for mask patterning debris removal | Karthik Balakrishnan, Jungrae Park, Arunkumar TATTI, Eng Sheng Peh | 2024-08-20 |
| 11871667 | Methods and apparatus for warpage correction | Puay Han Tan, Karrthik Parathithasan, Jun-Liang Su, Fang Jie Lim, Chin Wei Tan +1 more | 2024-01-09 |
| 11739411 | Lattice coat surface enhancement for chamber components | Lit Ping LAM, Ian Ong | 2023-08-29 |
| 11721583 | Mainframe-less wafer transfer platform with linear transfer system for wafer processing modules | Karthik Balakrishnan, Karthik Elumalai, Eng Sheng Peh | 2023-08-08 |
| 11421316 | Methods and apparatus for controlling warpage in wafer level packaging processes | Prayudi Lianto, Mohamed Rafi, Muhammad Azim Bin Syed Sulaiman, Guan Huei See, Ang Yu Xin Kristy +2 more | 2022-08-23 |
| 11342226 | Hybrid wafer dicing approach using an actively-focused laser beam laser scribing process and plasma etch process | Karthik Balakrishnan, Jungrae Park, Eng Sheng Peh | 2022-05-24 |
| 11309278 | Methods for bonding substrates | Prayudi Lianto, Guan Huei See, Arvind Sundarrajan, Xundong Dai, Peter Khai Mum Fung | 2022-04-19 |
| 11302549 | Substrate vacuum transport and storage apparatus | Eng Sheng Peh, Srinivas D. Nemani, Arvind Sundarrajan, Avinash Avula, Ellie Yieh | 2022-04-12 |
| 11177146 | Methods and apparatus for processing a substrate | Qi Jie Peng, Chin Wei Tan, Jun-Liang Su, Fang Jie Lim, Arvind Sundarrajan +1 more | 2021-11-16 |
| 11111583 | Substrate carrier system utilizing electrostatic chucking to accommodate substrate size heterogeneity | Karthik Elumalai, Jen Sern Lew, Mingwei Zhu | 2021-09-07 |
| 11053590 | Nozzle for uniform plasma processing | Rohit Mishra, Siva Suri Chandra Rao Bhesetti, Eng Sheng Peh, Shoju Vayyapron, Cheng Sun | 2021-07-06 |
| 10978334 | Sealing structure for workpiece to substrate bonding in a processing chamber | Chin Hock Toh, Tuck Foong Koh, Jen Sern Lew, Arvind Sundarrajan, Seshadri Ramaswami | 2021-04-13 |
| 10930542 | Apparatus for handling various sized substrates | Eng Sheng Peh, Karrthik Parathithasan, Fang Jie Lim | 2021-02-23 |
| 10903055 | Edge ring for bevel polymer reduction | Rohit Mishra, Graeme Scott, Khalid Mohiuddin Sirajuddin, Sheshraj L. Yulshibagwale | 2021-01-26 |
| 10847400 | Adhesive-less substrate bonding to carrier plate | Arvind Sundarrajan, Karrthik Parathithasan, Qi Jie Peng, Manorajh Arunakiri | 2020-11-24 |
| 10784134 | Image based substrate mapper | Eng Sheng Peh, Karthik Balakrishnan | 2020-09-22 |
| 10777442 | Hybrid substrate carrier | Shoju Vayyapron, ANAND MAHADEV, Shankeerthan Kalyanasundaram, Eng Sheng Peh | 2020-09-15 |
| 10607870 | Substrate carrier for active/passive bonding and de-bonding of a substrate | Jen Sern Lew | 2020-03-31 |
| 10566226 | Multi-cassette carrying case | Eng Sheng Peh, Srinivas D. Nemani, Arvind Sundarrajan, Avinash Avula, Ellie Yieh +2 more | 2020-02-18 |
| 10549324 | Method and apparatus for backside cleaning of substrates | Jen Sern Lew, Arvind Sundarrajan, Srinivas D. Nemani | 2020-02-04 |
| 10504762 | Bridging front opening unified pod (FOUP) | Karrthik Parathithasan, Fang Jie Lim, Eng Sheng Peh | 2019-12-10 |
| 10465288 | Nozzle for uniform plasma processing | Rohit Mishra, Siva Suri Chandra Rao Bhesetti, Eng Sheng Peh, Shoju Vayyapron, Cheng Sun | 2019-11-05 |
| 10446423 | Next generation warpage measurement system | Jun-Liang Su, Karthik Elumalai, Eng Sheng Peh, Dimantha Rajapaksa | 2019-10-15 |
| 10347516 | Substrate transfer chamber | Eng Sheng Peh, Srinivas D. Nemani, Arvind Sundarrajan, Avinash Avula, Ellie Yieh | 2019-07-09 |
| 10325790 | Methods and apparatus for correcting substrate deformity | Eng Sheng Peh, Jun-Liang Su, Shoju Vayyapron, Karthik Elumalai, Dimantha Rajapaksa +1 more | 2019-06-18 |