Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11871667 | Methods and apparatus for warpage correction | Sriskantharajah Thirunavukarasu, Puay Han Tan, Jun-Liang Su, Fang Jie Lim, Chin Wei Tan +1 more | 2024-01-09 |
| 10930542 | Apparatus for handling various sized substrates | Sriskantharajah Thirunavukarasu, Eng Sheng Peh, Fang Jie Lim | 2021-02-23 |
| 10847400 | Adhesive-less substrate bonding to carrier plate | Sriskantharajah Thirunavukarasu, Arvind Sundarrajan, Qi Jie Peng, Manorajh Arunakiri | 2020-11-24 |
| 10504762 | Bridging front opening unified pod (FOUP) | Fang Jie Lim, Sriskantharajah Thirunavukarasu, Eng Sheng Peh | 2019-12-10 |