Issued Patents All Time
Showing 25 most recent of 59 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424446 | Silicon (Si) dry etch for die-to-wafer thinning | Guan Huei See, ChangBum YONG, Prayudi Lianto, Cheng-ko J. Sun | 2025-09-23 |
| 12374586 | Methods of TSV formation for advanced packaging | Peng Suo, Ying Wang, Guan Huei See, Chang Bum Yong | 2025-07-29 |
| 12138742 | Methods and apparatus for processing a substrate | Prayudi Lianto, Guan Huei See, Andrivo RUSYDI, Muhammad Avicenna Naradipa | 2024-11-12 |
| 12048948 | Methods for forming microwave tunable composited thin-film dielectric layer | Yueh Sheng Ow, Yue Cui, Nuno Yen-Chu Chen, Guan Huei See, Felix Deng | 2024-07-30 |
| 12020992 | Methods and apparatus for processing a substrate | Prayudi Lianto, Guan Huei See, Muhammad Avicenna Naradipa, Andrivo RUSYDI | 2024-06-25 |
| 11854886 | Methods of TSV formation for advanced packaging | Peng Suo, Ying Wang, Guan Huei See, Chang Bum Yong | 2023-12-26 |
| 11791094 | Semiconductor substrate having magnetic core inductor | Peng Suo, Yu Gu, Guan Huei See | 2023-10-17 |
| 11421316 | Methods and apparatus for controlling warpage in wafer level packaging processes | Prayudi Lianto, Mohamed Rafi, Muhammad Azim Bin Syed Sulaiman, Guan Huei See, Ang Yu Xin Kristy +2 more | 2022-08-23 |
| 11404318 | Methods of forming through-silicon vias in substrates for advanced packaging | Peng Suo, Ying Wang, Guan Huei See, Chang Bum Yong | 2022-08-02 |
| 11373803 | Method of forming a magnetic core on a substrate | Peng Suo, Yu Gu, Guan Huei See | 2022-06-28 |
| 11309278 | Methods for bonding substrates | Prayudi Lianto, Guan Huei See, Sriskantharajah Thirunavukarasu, Xundong Dai, Peter Khai Mum Fung | 2022-04-19 |
| 11302549 | Substrate vacuum transport and storage apparatus | Sriskantharajah Thirunavukarasu, Eng Sheng Peh, Srinivas D. Nemani, Avinash Avula, Ellie Yieh | 2022-04-12 |
| 11289387 | Methods and apparatus for backside via reveal processing | Prayudi Lianto, Sik Hin Chi, SHIH-CHAO HUNG, Pin Gian Gan, Ricardo Fujii Vinluan +10 more | 2022-03-29 |
| 11177146 | Methods and apparatus for processing a substrate | Qi Jie Peng, Chin Wei Tan, Jun-Liang Su, Fang Jie Lim, Sriskantharajah Thirunavukarasu +1 more | 2021-11-16 |
| 10978334 | Sealing structure for workpiece to substrate bonding in a processing chamber | Chin Hock Toh, Tuck Foong Koh, Sriskantharajah Thirunavukarasu, Jen Sern Lew, Seshadri Ramaswami | 2021-04-13 |
| 10847400 | Adhesive-less substrate bonding to carrier plate | Sriskantharajah Thirunavukarasu, Karrthik Parathithasan, Qi Jie Peng, Manorajh Arunakiri | 2020-11-24 |
| 10651126 | Methods and apparatus for wafer-level die bridge | Chien-Kang HSIUNG | 2020-05-12 |
| 10636696 | Methods for forming vias in polymer layers | Yu Gu, Guan Huei See, Peng Suo, Prayudi Lianto | 2020-04-28 |
| 10566226 | Multi-cassette carrying case | Sriskantharajah Thirunavukarasu, Eng Sheng Peh, Srinivas D. Nemani, Avinash Avula, Ellie Yieh +2 more | 2020-02-18 |
| 10549324 | Method and apparatus for backside cleaning of substrates | Sriskantharajah Thirunavukarasu, Jen Sern Lew, Srinivas D. Nemani | 2020-02-04 |
| 10515927 | Methods and apparatus for semiconductor package processing | Prayudi Lianto, Guan Huei See, Ranga Rao Arnepalli, Prerna Goradia | 2019-12-24 |
| 10475735 | Methods and apparatus for 3D MIM capacitor package processing | Peng Suo, Guan Huei See | 2019-11-12 |
| 10347516 | Substrate transfer chamber | Sriskantharajah Thirunavukarasu, Eng Sheng Peh, Srinivas D. Nemani, Avinash Avula, Ellie Yieh | 2019-07-09 |
| 10319601 | Slurry for polishing of integrated circuit packaging | Ranga Rao Arnepalli, Prerna Goradia, Prayudi Lianto, Jie Zeng, Robert Jan Visser +1 more | 2019-06-11 |
| 10276424 | Method and apparatus for wafer level packaging | Guan Huei See, Yu Gu | 2019-04-30 |