Issued Patents All Time
Showing 26–50 of 59 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10229827 | Method of redistribution layer formation for advanced packaging applications | Han-Wen Chen, Steven Verhaverbeke, Roman Gouk, Guan Huei See, Yu Gu | 2019-03-12 |
| 10211072 | Method of reconstituted substrate formation for advanced packaging applications | Han-Wen Chen, Steven Verhaverbeke, Roman Gouk, Guan Huei See, Yu Gu +3 more | 2019-02-19 |
| 10153187 | Methods and apparatus for transferring a substrate | Sriskantharajah Thirunavukarasu, Eng Sheng Peh, Srinivas D. Nemani, Avinash Avula, Ellie Yieh | 2018-12-11 |
| 10047430 | Self-ionized and inductively-coupled plasma for sputtering and resputtering | Peijun Ding, Rong Tao, Zheng Xu, Daniel C. Lubben, Suraj Rengarajan +7 more | 2018-08-14 |
| 10002771 | Methods for chemical mechanical polishing (CMP) processing with ozone | Prayudi Lianto, Kuma Hsiung, Eric J. Bergman, John L. Klocke, Mohamed Rafi +2 more | 2018-06-19 |
| 9993853 | Method and apparatus for backside cleaning of substrates | Sriskantharajah Thirunavukarasu, Jen Sern Lew, Srinivas D. Nemani | 2018-06-12 |
| 9978639 | Methods for reducing copper overhang in a feature of a substrate | Siew Kit Hoi, Jiao Song | 2018-05-22 |
| 9954051 | Structure and method of fabricating three-dimensional (3D) metal-insulator-metal (MIM) capacitor and resistor in semi-additive plating metal wiring | Guan Huei See, Chin Hock Toh, Glen T. Mori | 2018-04-24 |
| 9922874 | Methods of enhancing polymer adhesion to copper | Prayudi Lianto, Sam Lee, Charles Sharbono, Marvin L. Bernt, Guan Huei See | 2018-03-20 |
| 9740111 | Electrostatic carrier for handling substrates for processing | Jen Sern Lew, Sriskantharajah Thirunavukarasu, Karthik Elumalai | 2017-08-22 |
| 9472392 | Step coverage dielectric | Zongbin Wang, Shalina Sudheeran, Loke Yuen Wong | 2016-10-18 |
| 9362111 | Hermetic CVD-cap with improved step coverage in high aspect ratio structures | Zongbin Wang, Shalina Sudheeran, Bharat Bhushan | 2016-06-07 |
| 9305838 | BEOL interconnect with carbon nanotubes | Pravin K. Narwankar, JOE GRIFFITH CRUZ, Murali Narasimhan, Subbalakshmi Sreekala, Victor L. Pushparaj | 2016-04-05 |
| 8951913 | Method for removing native oxide and associated residue from a substrate | Bo Zheng, Xinyu Fu | 2015-02-10 |
| 8912096 | Methods for precleaning a substrate prior to metal silicide fabrication process | Bo Zheng, Manish Hamkar | 2014-12-16 |
| 8871064 | Electromagnet array in a sputter reactor | Tza-Jing Gung, Xinyu Fu, Edward P. Hammond, IV, Praburam Gopalraja, John C. Forster +2 more | 2014-10-28 |
| 8772162 | Method for removing native oxide and associated residue from a substrate | Bo Zheng, Xinyu Fu | 2014-07-08 |
| 8764961 | Cu surface plasma treatment to improve gapfill window | Qian Luo, Hua Chung, Xianmin Tang, Jick Yu, Murali Narasimhan | 2014-07-01 |
| 8747686 | Methods of end point detection for substrate fabrication processes | Bo Zheng, Mei Chang | 2014-06-10 |
| 8696875 | Self-ionized and inductively-coupled plasma for sputtering and resputtering | Peijun Ding, Rong Tao, Zheng Xu, Daniel C. Lubben, Suraj Rengarajan +7 more | 2014-04-15 |
| 8668816 | Self-ionized and inductively-coupled plasma for sputtering and resputtering | Peijun Ding, Rong Tao, Zheng Xu, Daniel C. Lubben, Suraj Rengarajan +7 more | 2014-03-11 |
| 8642473 | Methods for contact clean | Mei Chang, Linh Thanh, Bo Zheng, John C. Forster, Umesh M. Kellkar +1 more | 2014-02-04 |
| 8455352 | Method for removing native oxide and associated residue from a substrate | Bo Zheng, Xinyu Fu | 2013-06-04 |
| 7807568 | Methods for reducing damage to substrate layers in deposition processes | Xinyu Fu | 2010-10-05 |
| 7686926 | Multi-step process for forming a metal barrier in a sputter reactor | Tza-Jing Gung, Xinyu Fu, Edward P. Hammond, IV, Praburam Gopalraja, John C. Forster +2 more | 2010-03-30 |