Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11948885 | Methods and apparatus for forming dual metal interconnects | Suketu Arun Parikh, Roey Shaviv, Joung Joo Lee, Seshadri Ganguli, Shirish A. PETHE +3 more | 2024-04-02 |
| 11075165 | Methods and apparatus for forming dual metal interconnects | Suketu Arun Parikh, Roey Shaviv, Joung Joo Lee, Seshadri Ganguli, Shirish A. PETHE +3 more | 2021-07-27 |
| 10304732 | Methods and apparatus for filling substrate features with cobalt | Wenting Hou, Jianxin Lei, Joung Joo Lee | 2019-05-28 |
| 10047430 | Self-ionized and inductively-coupled plasma for sputtering and resputtering | Peijun Ding, Zheng Xu, Daniel C. Lubben, Suraj Rengarajan, Michael Miller +7 more | 2018-08-14 |
| 10014179 | Methods for forming cobalt-copper selective fill for an interconnect | Tae Hong Ha, Xianmin Tang, Joung Joo Lee | 2018-07-03 |
| 8993434 | Methods for forming layers on a substrate | Jick Yu, Xinyu Fu | 2015-03-31 |
| 8696875 | Self-ionized and inductively-coupled plasma for sputtering and resputtering | Peijun Ding, Zheng Xu, Daniel C. Lubben, Suraj Rengarajan, Michael Miller +7 more | 2014-04-15 |
| 8668816 | Self-ionized and inductively-coupled plasma for sputtering and resputtering | Peijun Ding, Zheng Xu, Daniel C. Lubben, Suraj Rengarajan, Michael Miller +7 more | 2014-03-11 |
| 8500963 | Sputtering of thermally resistive materials including metal chalcogenides | Mengqi Ye, Keith A. Miller, Peijun Ding, Goichi Yoshidome | 2013-08-06 |
| 8293647 | Bottom up plating by organic surface passivation and differential plating retardation | Jenn-Yue Wang, Hua Chung, Hong Mei Zhang | 2012-10-23 |
| 6875321 | Auxiliary magnet array in conjunction with magnetron sputtering | Peijun Ding, Zheng Xu | 2005-04-05 |
| 6627542 | Continuous, non-agglomerated adhesion of a seed layer to a barrier layer | Srinivas Gandikota, Liang-Yuh Chen, Seshadri Ramaswami | 2003-09-30 |
| 6610184 | Magnet array in conjunction with rotating magnetron for plasma sputtering | Peijun Ding, Zheng Xu | 2003-08-26 |
| 6207222 | Dual damascene metallization | Liang-Yuh Chen, Ted Guo, Roderick C. Mosely | 2001-03-27 |
| 6200433 | IMP technology with heavy gas sputtering | Peijun Ding, Barry Chin, Dan Carl | 2001-03-13 |
| 6139697 | Low temperature integrated via and trench fill process and apparatus | Liang-Yuh Chen, Roderick C. Mosely, Fusen Chen, Ted Guo | 2000-10-31 |
| 5989623 | Dual damascene metallization | Liang-Yuh Chen, Ted Guo, Roderick C. Mosely | 1999-11-23 |