| 10047430 |
Self-ionized and inductively-coupled plasma for sputtering and resputtering |
Peijun Ding, Rong Tao, Zheng Xu, Daniel C. Lubben, Suraj Rengarajan +7 more |
2018-08-14 |
| 8696875 |
Self-ionized and inductively-coupled plasma for sputtering and resputtering |
Peijun Ding, Rong Tao, Zheng Xu, Daniel C. Lubben, Suraj Rengarajan +7 more |
2014-04-15 |
| 8668816 |
Self-ionized and inductively-coupled plasma for sputtering and resputtering |
Peijun Ding, Rong Tao, Zheng Xu, Daniel C. Lubben, Suraj Rengarajan +7 more |
2014-03-11 |
| 7674360 |
Mechanism for varying the spacing between sputter magnetron and target |
Ilyoung Richard Hong, Donny Young, Michael Rosenstein, Robert B. Lowrance, Daniel C. Lubben +3 more |
2010-03-09 |
| 7294574 |
Sputter deposition and etching of metallization seed layer for overhang and sidewall improvement |
Peijun Ding, Fuhong Zhang, Hsien-Lung Yang, Jianming Fu, Jick Yu +2 more |
2007-11-13 |
| 6852202 |
Small epicyclic magnetron with controlled radial sputtering profile |
James Tsung, Daniel C. Lubben, Ilyoung Richard Hong, Peijun Ding |
2005-02-08 |
| 6627050 |
Method and apparatus for depositing a tantalum-containing layer on a substrate |
Peijun Ding, Howard H. Tang, Tony P. Chiang, Jianming Fu |
2003-09-30 |
