Issued Patents All Time
Showing 25 most recent of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9217197 | Methods for depositing a layer on a substrate using surface energy modulation | — | 2015-12-22 |
| 8993434 | Methods for forming layers on a substrate | Rong Tao, Xinyu Fu | 2015-03-31 |
| 8852674 | Method for segregating the alloying elements and reducing the residue resistivity of copper alloy layers | Xinyu Fu | 2014-10-07 |
| 8764961 | Cu surface plasma treatment to improve gapfill window | Qian Luo, Arvind Sundarrajan, Hua Chung, Xianmin Tang, Murali Narasimhan | 2014-07-01 |
| 8580354 | Plasma treatment of substrates prior to deposition | Xinyu Fu | 2013-11-12 |
| 8557094 | Sputtering chamber having auxiliary backside magnet to improve etch uniformity and magnetron producing sustained self sputtering of ruthenium and tantalum | Xianmin Tang, Hua Chung, Rongjun Wang, Tza-Jing Gung, Praburam Gopalraja +1 more | 2013-10-15 |
| 8349724 | Method for improving electromigration lifetime of copper interconnection by extended post anneal | Xinyu Fu | 2013-01-08 |
| 8324095 | Integration of ALD tantalum nitride for copper metallization | Hua Chung, Nirmalya Maity, Roderick C. Mosely, Mei Chang | 2012-12-04 |
| 8119525 | Process for selective growth of films during ECP plating | Wei Wang, Rongjun Wang, Hua Chung | 2012-02-21 |
| 8021514 | Remote plasma source for pre-treatment of substrates prior to deposition | Xinyu Fu | 2011-09-20 |
| 7737028 | Selective ruthenium deposition on copper materials | Rongjun Wang, Hua Chung, Praburam Gopalraja | 2010-06-15 |
| 7704887 | Remote plasma pre-clean with low hydrogen pressure | Xinyu Fu, John C. Forster, Ajay Bhatnagar, Praburam Gopalraja | 2010-04-27 |
| 7659204 | Oxidized barrier layer | Xianmin Tang, Hua Chung, Rongjun Wang, Praburam Gopalraja, Jenn-Yue Wang | 2010-02-09 |
| 7494908 | Apparatus for integration of barrier layer and seed layer | Hua Chung, Ling Chen, Mei Chang | 2009-02-24 |
| 7352048 | Integration of barrier layer and seed layer | Hua Chung, Ling Chen, Mei Chang | 2008-04-01 |
| 7294574 | Sputter deposition and etching of metallization seed layer for overhang and sidewall improvement | Peijun Ding, Fuhong Zhang, Hsien-Lung Yang, Michael Miller, Jianming Fu +2 more | 2007-11-13 |
| 7265048 | Reduction of copper dewetting by transition metal deposition | Hua Chung, Seshadri Ganguli, Christophe Marcadal | 2007-09-04 |
| 7049226 | Integration of ALD tantalum nitride for copper metallization | Hua Chung, Nirmalya Maity, Roderick C. Mosely, Mei Chang | 2006-05-23 |
| 6936906 | Integration of barrier layer and seed layer | Hua Chung, Ling Chen, Mei Chang | 2005-08-30 |
| 6899796 | Partially filling copper seed layer | Wei Wang, Anantha K. Subramani, Jianming Fu, Praburam Gopalraja, Fusen Chen | 2005-05-31 |
| 6887786 | Method and apparatus for forming a barrier layer on a substrate | Hong Mei Zhang, Xianmin Tang, Praburam Gopalraja, John C. Forster | 2005-05-03 |
| 6884329 | Diffusion enhanced ion plating for copper fill | Wei Wang, Anantha K. Subramani, Jianming Fu, Praburam Gopalraja, Fusen Chen | 2005-04-26 |
| 6746727 | Metal to ILD adhesion improvement by reactive sputtering | Chi-Hing Choi | 2004-06-08 |
| 6730598 | Integration of annealing capability into metal deposition or CMP tool | — | 2004-05-04 |
| 6365514 | Two chamber metal reflow process | Ruth A. Brain | 2002-04-02 |