Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11721583 | Mainframe-less wafer transfer platform with linear transfer system for wafer processing modules | Sriskantharajah Thirunavukarasu, Karthik Balakrishnan, Eng Sheng Peh | 2023-08-08 |
| 11600492 | Electrostatic chuck with reduced current leakage for hybrid laser scribing and plasma etch wafer singulation process | Sai Abhinand, Michael Lesley Sorensen, Dimantha Rajapaksa, Cheng Sun, James S. Papanu +4 more | 2023-03-07 |
| 11421316 | Methods and apparatus for controlling warpage in wafer level packaging processes | Prayudi Lianto, Mohamed Rafi, Muhammad Azim Bin Syed Sulaiman, Guan Huei See, Ang Yu Xin Kristy +2 more | 2022-08-23 |
| 11111583 | Substrate carrier system utilizing electrostatic chucking to accommodate substrate size heterogeneity | Sriskantharajah Thirunavukarasu, Jen Sern Lew, Mingwei Zhu | 2021-09-07 |
| 10446423 | Next generation warpage measurement system | Jun-Liang Su, Eng Sheng Peh, Sriskantharajah Thirunavukarasu, Dimantha Rajapaksa | 2019-10-15 |
| 10325790 | Methods and apparatus for correcting substrate deformity | Eng Sheng Peh, Sriskantharajah Thirunavukarasu, Jun-Liang Su, Shoju Vayyapron, Dimantha Rajapaksa +1 more | 2019-06-18 |
| 9845533 | Substrate carrier system utilizing electrostatic chucking to accommodate substrate size heterogeneity | Sriskantharajah Thirunavukarasu, Jen Sern Lew, Mingwei Zhu | 2017-12-19 |
| 9818624 | Methods and apparatus for correcting substrate deformity | Jen Sern Lew, Tuck Foong Koh, Sriskantharajah Thirunavukarasu, Eng Sheng Peh, Jun-Liang Su | 2017-11-14 |
| 9740111 | Electrostatic carrier for handling substrates for processing | Arvind Sundarrajan, Jen Sern Lew, Sriskantharajah Thirunavukarasu | 2017-08-22 |
| 9478697 | Reusable substrate carrier | Sriskantharajah Thirunavukarasu, Mingwei Zhu, Thean Ming Tan, Yong Cao, Daniel Lee Diehl +1 more | 2016-10-25 |