TK

Tuck Foong Koh

Applied Materials: 11 patents #1,198 of 7,310Top 20%
Overall (All Time): #436,605 of 4,157,543Top 15%
11
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
12315739 Isotropic silicon nitride removal Mikhail Korolik, Paul Edward Gee, Wei Ying Doreen Yong, John Sudijono, Philip Allan Kraus +1 more 2025-05-27
12057299 Methods for selective removal of contact oxides John Sudijono 2024-08-06
11670513 Apparatus and systems for substrate processing for lowering contact resistance Yueh Sheng Ow, Junqi Wei, Wen Long Favier Shoo, Ananthkrishna Jupudi, Takashi Shimizu +1 more 2023-06-06
11629409 Inline microwave batch degas chamber Ribhu Gautam, Ananthkrishna Jupudi, Preetham Rao, Vinodh Ramachandran, Yueh Sheng Ow +3 more 2023-04-18
11610807 Methods and apparatus for cleaving of semiconductor substrates Felix Deng, Yueh Sheng Ow, Nuno Yen-Chu Chen, Yuichi Wada, Sree Rangasai V. Kesapragada +1 more 2023-03-21
11569122 Methods and apparatus for cleaving of semiconductor substrates Felix Deng, Yueh Sheng Ow, Nuno Yen-Chu Chen, Yuichi Wada, Sree Rangasai V. Kesapragada +1 more 2023-01-31
11375584 Methods and apparatus for processing a substrate using microwave energy Yueh Sheng Ow, Nuno Yen-Chu Chen, Ananthkrishna Jupudi, Preetham Rao 2022-06-28
11328929 Methods, apparatuses and systems for substrate processing for lowering contact resistance Yueh Sheng Ow, Junqi Wei, Wen Long Favier Shoo, Ananthkrishna Jupudi, Takashi Shimizu +1 more 2022-05-10
10991617 Methods and apparatus for cleaving of semiconductor substrates Felix Deng, Yueh Sheng Ow, Nuno Yen-Chu Chen, Yuichi Wada, Sree Rangasai V. Kesapragada +1 more 2021-04-27
10978334 Sealing structure for workpiece to substrate bonding in a processing chamber Chin Hock Toh, Sriskantharajah Thirunavukarasu, Jen Sern Lew, Arvind Sundarrajan, Seshadri Ramaswami 2021-04-13
9818624 Methods and apparatus for correcting substrate deformity Jen Sern Lew, Sriskantharajah Thirunavukarasu, Karthik Elumalai, Eng Sheng Peh, Jun-Liang Su 2017-11-14