Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11610807 | Methods and apparatus for cleaving of semiconductor substrates | Felix Deng, Yueh Sheng Ow, Tuck Foong Koh, Nuno Yen-Chu Chen, Yuichi Wada +1 more | 2023-03-21 |
| 11569122 | Methods and apparatus for cleaving of semiconductor substrates | Felix Deng, Yueh Sheng Ow, Tuck Foong Koh, Nuno Yen-Chu Chen, Yuichi Wada +1 more | 2023-01-31 |
| 10991617 | Methods and apparatus for cleaving of semiconductor substrates | Felix Deng, Yueh Sheng Ow, Tuck Foong Koh, Nuno Yen-Chu Chen, Yuichi Wada +1 more | 2021-04-27 |
| 10815561 | Method and apparatus for asymmetric selective physical vapor deposition | Joung Joo Lee, Bencherki Mebarki, Xianmin Tang, Keith A. Miller, Sudarsan Srinivasan | 2020-10-27 |
| 10714388 | Method and apparatus for depositing cobalt in a feature | Jin-Hee Park, Tae Hong Ha, Sang-Hyeob Lee, Thomas Jongwan Kwon, Jaesoo Ahn +2 more | 2020-07-14 |
| 10707122 | Methods for depositing dielectric barrier layers and aluminum containing etch stop layers | Kevin Moraes, Srinivas Guggilla, He Ren, Mehul Naik, David Thompson +6 more | 2020-07-07 |
| 10559578 | Deposition of cobalt films with high deposition rate | Jacqueline S. Wrench, Jing Zhou, Fuqun Grace Vasiknanonte, Jiang Lu, Paul F. Ma +3 more | 2020-02-11 |
| 10157787 | Method and apparatus for depositing cobalt in a feature | Jin-Hee Park, Tae Hong Ha, Sang-Hyeob Lee, Thomas Jongwan Kwon, Jaesoo Ahn +2 more | 2018-12-18 |
| 10109520 | Methods for depositing dielectric barrier layers and aluminum containing etch stop layers | Kevin Moraes, Srinivas Guggilla, He Ren, Mehul Naik, David Thompson +6 more | 2018-10-23 |
| 9984976 | Interconnect structures and methods of formation | Yana Cheng, Yong Cao, Srinivas Guggilla, Xianmin Tang, Deenesh Padhi | 2018-05-29 |
| 9601431 | Dielectric/metal barrier integration to prevent copper diffusion | He Ren, Mehul Naik, Yong Cao, Mei-Yee Shek, Yana Cheng | 2017-03-21 |
| 9299605 | Methods for forming passivation protection for an interconnection structure | He Ren, Mehul Naik, Yong Cao, Mei-Yee Shek, Yana Cheng | 2016-03-29 |