Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12048948 | Methods for forming microwave tunable composited thin-film dielectric layer | Yueh Sheng Ow, Yue Cui, Arvind Sundarrajan, Guan Huei See, Felix Deng | 2024-07-30 |
| 11929260 | Low warpage curing methodology by inducing curvature | Fang Jie Lim, Chin Wei Tan, Jun-Liang Su, Felix Deng, Sai Kumar Kodumuri +1 more | 2024-03-12 |
| D1007449 | Target profile for a physical vapor deposition chamber target | David Gunther, Kirankumar Neelasandra SAVANDAIAH, Jiao Song, Madan Kumar Shimoga Mylarappa, Yue Cui +1 more | 2023-12-12 |
| 11610807 | Methods and apparatus for cleaving of semiconductor substrates | Felix Deng, Yueh Sheng Ow, Tuck Foong Koh, Yuichi Wada, Sree Rangasai V. Kesapragada +1 more | 2023-03-21 |
| 11569122 | Methods and apparatus for cleaving of semiconductor substrates | Felix Deng, Yueh Sheng Ow, Tuck Foong Koh, Yuichi Wada, Sree Rangasai V. Kesapragada +1 more | 2023-01-31 |
| 11375584 | Methods and apparatus for processing a substrate using microwave energy | Tuck Foong Koh, Yueh Sheng Ow, Ananthkrishna Jupudi, Preetham Rao | 2022-06-28 |
| 10991617 | Methods and apparatus for cleaving of semiconductor substrates | Felix Deng, Yueh Sheng Ow, Tuck Foong Koh, Yuichi Wada, Sree Rangasai V. Kesapragada +1 more | 2021-04-27 |