Patents per Year
Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 12048948 | Methods for forming microwave tunable composited thin-film dielectric layer | Yueh Sheng Ow, Yue Cui, Arvind Sundarrajan, Nuno Yen-Chu Chen, Guan Huei See | 2024-07-30 | $79,851,000 |
| 11929260 | Low warpage curing methodology by inducing curvature | Fang Jie Lim, Chin Wei Tan, Jun-Liang Su, Sai Kumar Kodumuri, Ananthkrishna Jupudi +1 more | 2024-03-12 | $97,620,000 |
| 11610807 | Methods and apparatus for cleaving of semiconductor substrates | Yueh Sheng Ow, Tuck Foong Koh, Nuno Yen-Chu Chen, Yuichi Wada, Sree Rangasai V. Kesapragada +1 more | 2023-03-21 | $36,722,000 |
| 11569122 | Methods and apparatus for cleaving of semiconductor substrates | Yueh Sheng Ow, Tuck Foong Koh, Nuno Yen-Chu Chen, Yuichi Wada, Sree Rangasai V. Kesapragada +1 more | 2023-01-31 | $29,381,000 |
| 10991617 | Methods and apparatus for cleaving of semiconductor substrates | Yueh Sheng Ow, Tuck Foong Koh, Nuno Yen-Chu Chen, Yuichi Wada, Sree Rangasai V. Kesapragada +1 more | 2021-04-27 | $107,454,000 |