Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11610807 | Methods and apparatus for cleaving of semiconductor substrates | Felix Deng, Yueh Sheng Ow, Tuck Foong Koh, Nuno Yen-Chu Chen, Yuichi Wada +1 more | 2023-03-21 |
| 11569122 | Methods and apparatus for cleaving of semiconductor substrates | Felix Deng, Yueh Sheng Ow, Tuck Foong Koh, Nuno Yen-Chu Chen, Yuichi Wada +1 more | 2023-01-31 |
| 11289357 | Methods and apparatus for high voltage electrostatic chuck protection | Yuichi Wada, Yueh Sheng Ow, Ananthkrishna Jupudi, Kai Liang Liew, Sarath Babu | 2022-03-29 |
| 10991617 | Methods and apparatus for cleaving of semiconductor substrates | Felix Deng, Yueh Sheng Ow, Tuck Foong Koh, Nuno Yen-Chu Chen, Yuichi Wada +1 more | 2021-04-27 |