Issued Patents All Time
Showing 25 most recent of 63 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11901232 | Automatic kerf offset mapping and correction system for laser dicing | Karthik Balakrishnan, Jungrae Park, Zavier Zai Yeong Tan, Sai Abhinand | 2024-02-13 |
| 11854888 | Laser scribing trench opening control in wafer dicing using hybrid laser scribing and plasma etch approach | Jungrae Park, Zavier Zai Yeong Tan, Karthik Balakrishnan, Wei-Sheng Lei | 2023-12-26 |
| 11764061 | Water soluble organic-inorganic hybrid mask formulations and their applications | Wenguang Li | 2023-09-19 |
| 11600492 | Electrostatic chuck with reduced current leakage for hybrid laser scribing and plasma etch wafer singulation process | Sai Abhinand, Michael Lesley Sorensen, Karthik Elumalai, Dimantha Rajapaksa, Cheng Sun +4 more | 2023-03-07 |
| 11217536 | Hybrid wafer dicing approach using a split beam laser scribing process and plasma etch process | Jungrae Park, Wei-Sheng Lei, Brad Eaton, Ajay Kumar | 2022-01-04 |
| 11211247 | Water soluble organic-inorganic hybrid mask formulations and their applications | Wenguang Li | 2021-12-28 |
| 11158540 | Light-absorbing mask for hybrid laser scribing and plasma etch wafer singulation process | Wenguang Li, Wei-Sheng Lei, Prabhat Kumar, Brad Eaton, Ajay Kumar +1 more | 2021-10-26 |
| 11011424 | Hybrid wafer dicing approach using a spatially multi-focused laser beam laser scribing process and plasma etch process | Jungrae Park, Zavier Zai Yeong Tan | 2021-05-18 |
| 10903121 | Hybrid wafer dicing approach using a uniform rotating beam laser scribing process and plasma etch process | Jungrae Park, Karthik Balakrishnan | 2021-01-26 |
| 10535561 | Hybrid wafer dicing approach using a multiple pass laser scribing process and plasma etch process | Jungrae Park, Ajay Kumar, Wei-Sheng Lei | 2020-01-14 |
| 9972575 | Hybrid wafer dicing approach using a split beam laser scribing process and plasma etch process | Jungrae Park, Wei-Sheng Lei, Brad Eaton, Ajay Kumar | 2018-05-15 |
| 9852997 | Hybrid wafer dicing approach using a rotating beam laser scribing process and plasma etch process | Jungrae Park, Wei-Sheng Lei, Brad Eaton, Ajay Kumar | 2017-12-26 |
| 9793132 | Etch mask for hybrid laser scribing and plasma etch wafer singulation process | Wenguang Li, Ramesh Krishnamurthy, Prabhat Kumar, Brad Eaton, Ajay Kumar +1 more | 2017-10-17 |
| 9768014 | Wafer coating | Jungrae Park, Wei-Sheng Lei, Prabhat Kumar, Brad Eaton, Ajay Kumar | 2017-09-19 |
| 9601375 | UV-cure pre-treatment of carrier film for wafer dicing using hybrid laser scribing and plasma etch approach | Wei-Sheng Lei, Brad Eaton, Jungrae Park, Ajay Kumar, Prabhat Kumar | 2017-03-21 |
| 9583375 | Water soluble mask formation by dry film lamination | Wei-Sheng Lei, Brad Eaton, Ajay Kumar | 2017-02-28 |
| 9443765 | Water soluble mask formation by dry film vacuum lamination for laser and plasma dicing | Wei-Sheng Lei, Prabhat Kumar, Brad Eaton, Ajay Kumar | 2016-09-13 |
| 9412619 | Method of outgassing a mask material deposited over a workpiece in a process tool | Prabhat Kumar, Wei-Sheng Lei, Martin S. Wohlert, Brad Eaton, Ajay Kumar | 2016-08-09 |
| 9355907 | Hybrid wafer dicing approach using a line shaped laser beam profile laser scribing process and plasma etch process | Wei-Sheng Lei, Jungrae Park, Prabhat Kumar, Brad Eaton, Ajay Kumar | 2016-05-31 |
| 9343366 | Dicing wafers having solder bumps on wafer backside | Wei-Sheng Lei, Aparna Iyer, Brad Eaton, Ajay Kumar | 2016-05-17 |
| 9312177 | Screen print mask for laser scribe and plasma etch wafer dicing process | Prabhat Kumar, Brad Eaton, Wei-Sheng Lei, Ajay Kumar | 2016-04-12 |
| 9299611 | Method of wafer dicing using hybrid laser scribing and plasma etch approach with mask plasma treatment for improved mask etch resistance | Wei-Sheng Lei, Brad Eaton, Ajay Kumar, Jungrae Park | 2016-03-29 |
| 9281244 | Hybrid wafer dicing approach using an adaptive optics-controlled laser scribing process and plasma etch process | Jungrae Park, Wei-Sheng Lei, Brad Eaton, Ajay Kumar | 2016-03-08 |
| 9275902 | Dicing processes for thin wafers with bumps on wafer backside | Wei-Sheng Lei, Aparna Iyer, Brad Eaton, Ajay Kumar | 2016-03-01 |
| 9245803 | Hybrid wafer dicing approach using a bessel beam shaper laser scribing process and plasma etch process | Jungrae Park, Wei-Sheng Lei, Brad Eaton, Ajay Kumar | 2016-01-26 |