Issued Patents All Time
Showing 25 most recent of 93 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12257659 | Waste collection and abatement during hybrid additive and subtractive manufacturing | Stephen T. Connor, Fabio R. Zurcher, Matthew McKay | 2025-03-25 |
| 12131952 | Wafer dicing using femtosecond-based laser and plasma etch | Wei-Sheng Lei, Madhava Rao Yalamanchili, Saravjeet Singh, Ajay Kumar, James M. Holden | 2024-10-29 |
| 11621194 | Wafer dicing using femtosecond-based laser and plasma etch | Wei-Sheng Lei, Madhava Rao Yalamanchili, Saravjeet Singh, Ajay Kumar, James M. Holden | 2023-04-04 |
| 11355394 | Wafer dicing using hybrid laser scribing and plasma etch approach with intermediate breakthrough treatment | Wei-Sheng Lei, Ajay Kumar | 2022-06-07 |
| 11217536 | Hybrid wafer dicing approach using a split beam laser scribing process and plasma etch process | Jungrae Park, Wei-Sheng Lei, James S. Papanu, Ajay Kumar | 2022-01-04 |
| 11158540 | Light-absorbing mask for hybrid laser scribing and plasma etch wafer singulation process | Wenguang Li, James S. Papanu, Wei-Sheng Lei, Prabhat Kumar, Ajay Kumar +1 more | 2021-10-26 |
| 10910271 | Wafer dicing using femtosecond-based laser and plasma etch | Wei-Sheng Lei, Madhava Rao Yalamanchili, Saravjeet Singh, Ajay Kumar, James M. Holden | 2021-02-02 |
| 10714390 | Wafer dicing using femtosecond-based laser and plasma etch | Wei-Sheng Lei, Madhava Rao Yalamanchili, Saravjeet Singh, Ajay Kumar, James M. Holden | 2020-07-14 |
| 10692765 | Transfer arm for film frame substrate handling during plasma singulation of wafers | James M. Holden, Alexander Lerner, Ajay Kumar, Aparna Iyer | 2020-06-23 |
| 10661383 | Mitigation of particle contamination for wafer dicing processes | Wei-Sheng Lei, Jungrae Park, Ajay Kumar | 2020-05-26 |
| 10566238 | Wafer dicing using femtosecond-based laser and plasma etch | Wei-Sheng Lei, Madhava Rao Yalamanchili, Saravjeet Singh, Ajay Kumar, James M. Holden | 2020-02-18 |
| 10363629 | Mitigation of particle contamination for wafer dicing processes | Wei-Sheng Lei, Jungrae Park, Ajay Kumar | 2019-07-30 |
| 10163713 | Wafer dicing using femtosecond-based laser and plasma etch | Wei-Sheng Lei, Madhava Rao Yalamanchili, Saravjeet Singh, Ajay Kumar, James M. Holden | 2018-12-25 |
| 9972575 | Hybrid wafer dicing approach using a split beam laser scribing process and plasma etch process | Jungrae Park, Wei-Sheng Lei, James S. Papanu, Ajay Kumar | 2018-05-15 |
| 9852997 | Hybrid wafer dicing approach using a rotating beam laser scribing process and plasma etch process | Jungrae Park, Wei-Sheng Lei, James S. Papanu, Ajay Kumar | 2017-12-26 |
| 9793132 | Etch mask for hybrid laser scribing and plasma etch wafer singulation process | Wenguang Li, James S. Papanu, Ramesh Krishnamurthy, Prabhat Kumar, Ajay Kumar +1 more | 2017-10-17 |
| 9768014 | Wafer coating | Jungrae Park, Wei-Sheng Lei, Prabhat Kumar, James S. Papanu, Ajay Kumar | 2017-09-19 |
| 9721839 | Etch-resistant water soluble mask for hybrid wafer dicing using laser scribing and plasma etch | Wei-Sheng Lei, Mohammad Kamruzzaman Chowdhury, Ajay Kumar | 2017-08-01 |
| 9620379 | Multi-layer mask including non-photodefinable laser energy absorbing layer for substrate dicing by laser and plasma etch | Wei-Sheng Lei, Mohammad Kamruzzaman Chowdhury, Todd Egan, Madhava Rao Yalamanchili, Ajay Kumar | 2017-04-11 |
| 9601375 | UV-cure pre-treatment of carrier film for wafer dicing using hybrid laser scribing and plasma etch approach | Wei-Sheng Lei, Jungrae Park, Ajay Kumar, James S. Papanu, Prabhat Kumar | 2017-03-21 |
| 9583375 | Water soluble mask formation by dry film lamination | Wei-Sheng Lei, James S. Papanu, Ajay Kumar | 2017-02-28 |
| 9460966 | Method and apparatus for dicing wafers having thick passivation polymer layer | Wei-Sheng Lei, Ajay Kumar | 2016-10-04 |
| 9443765 | Water soluble mask formation by dry film vacuum lamination for laser and plasma dicing | Wei-Sheng Lei, James S. Papanu, Prabhat Kumar, Ajay Kumar | 2016-09-13 |
| 9412619 | Method of outgassing a mask material deposited over a workpiece in a process tool | Prabhat Kumar, Wei-Sheng Lei, Martin S. Wohlert, James S. Papanu, Ajay Kumar | 2016-08-09 |
| 9355907 | Hybrid wafer dicing approach using a line shaped laser beam profile laser scribing process and plasma etch process | Wei-Sheng Lei, Jungrae Park, Prabhat Kumar, James S. Papanu, Ajay Kumar | 2016-05-31 |