Issued Patents All Time
Showing 26–50 of 93 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9349648 | Hybrid wafer dicing approach using a rectangular shaped two-dimensional top hat laser beam profile or a linear shaped one-dimensional top hat laser beam profile laser scribing process and plasma etch process | Wei-Sheng Lei, Prabhat Kumar, Jungrae Park, Ajay Kumar | 2016-05-24 |
| 9343366 | Dicing wafers having solder bumps on wafer backside | Wei-Sheng Lei, James S. Papanu, Aparna Iyer, Ajay Kumar | 2016-05-17 |
| 9330977 | Hybrid wafer dicing approach using a galvo scanner and linear stage hybrid motion laser scribing process and plasma etch process | Wei-Sheng Lei, Ajay Kumar | 2016-05-03 |
| 9312177 | Screen print mask for laser scribe and plasma etch wafer dicing process | Prabhat Kumar, Wei-Sheng Lei, James S. Papanu, Ajay Kumar | 2016-04-12 |
| 9299611 | Method of wafer dicing using hybrid laser scribing and plasma etch approach with mask plasma treatment for improved mask etch resistance | Wei-Sheng Lei, Ajay Kumar, James S. Papanu, Jungrae Park | 2016-03-29 |
| 9299614 | Method and carrier for dicing a wafer | James M. Holden, Aparna Iyer, Ajay Kumar | 2016-03-29 |
| 9281244 | Hybrid wafer dicing approach using an adaptive optics-controlled laser scribing process and plasma etch process | Jungrae Park, Wei-Sheng Lei, James S. Papanu, Ajay Kumar | 2016-03-08 |
| 9275902 | Dicing processes for thin wafers with bumps on wafer backside | Wei-Sheng Lei, James S. Papanu, Aparna Iyer, Ajay Kumar | 2016-03-01 |
| 9269604 | Wafer edge warp suppression for thin wafer supported by tape frame | Wei-Sheng Lei, Ajay Kumar | 2016-02-23 |
| 9263308 | Water soluble mask for substrate dicing by laser and plasma etch | Wei-Sheng Lei, Saravjeet Singh, Madhava Rao Yalamanchili, Ajay Kumar | 2016-02-16 |
| 9252057 | Laser and plasma etch wafer dicing with partial pre-curing of UV release dicing tape for film frame wafer application | Mohammad Kamruzzaman Chowdhury, Wei-Sheng Lei, Todd Egan, Madhava Rao Yalamanchili, Ajay Kumar | 2016-02-02 |
| 9245803 | Hybrid wafer dicing approach using a bessel beam shaper laser scribing process and plasma etch process | Jungrae Park, Wei-Sheng Lei, James S. Papanu, Ajay Kumar | 2016-01-26 |
| 9245802 | Wafer dicing using femtosecond-based laser and plasma etch | Wei-Sheng Lei, Madhava Rao Yalamanchili, Saravjeet Singh, Ajay Kumar, James M. Holden | 2016-01-26 |
| 9236305 | Wafer dicing with etch chamber shield ring for film frame wafer applications | Wei-Sheng Lei, Saravjeet Singh, Jivko Dinev, Aparna Iyer, Ajay Kumar | 2016-01-12 |
| 9224650 | Wafer dicing from wafer backside and front side | Wei-Sheng Lei, Ajay Kumar | 2015-12-29 |
| 9224625 | Laser and plasma etch wafer dicing using water-soluble die attach film | Wei-Sheng Lei, Madhava Rao Yalamanchili, Saravjeet Singh, Ajay Kumar | 2015-12-29 |
| 9218992 | Hybrid laser and plasma etch wafer dicing using substrate carrier | Saravjeet Singh, Ajay Kumar, Wei-Sheng Lei, James M. Holden, Madhava Rao Yalamanchili +1 more | 2015-12-22 |
| 9209084 | Maskless hybrid laser scribing and plasma etching wafer dicing process | Wei-Sheng Lei, James S. Papanu, Ajay Kumar | 2015-12-08 |
| 9196536 | Hybrid wafer dicing approach using a phase modulated laser beam profile laser scribing process and plasma etch process | Jungrae Park, Wei-Sheng Lei, James S. Papanu, Ajay Kumar | 2015-11-24 |
| 9177864 | Method of coating water soluble mask for laser scribing and plasma etch | Wei-Sheng Lei, Aparna Iyer, Todd Egan, Madhava Rao Yalamanchili, Ajay Kumar | 2015-11-03 |
| 9177861 | Hybrid wafer dicing approach using laser scribing process based on an elliptical laser beam profile or a spatio-temporal controlled laser beam profile | Jungrae Park, Wei-Sheng Lei, James S. Papanu, Ajay Kumar | 2015-11-03 |
| 9165832 | Method of die singulation using laser ablation and induction of internal defects with a laser | James S. Papanu, Wei-Sheng Lei, Jungrae Park, Alexander Lerner, Ajay Kumar | 2015-10-20 |
| 9159624 | Vacuum lamination of polymeric dry films for wafer dicing using hybrid laser scribing and plasma etch approach | Wei-Sheng Lei, Prabhat Kumar, James S. Papanu, Ajay Kumar | 2015-10-13 |
| 9159621 | Dicing tape protection for wafer dicing using laser scribe process | Wei-Sheng Lei, Ajay Kumar | 2015-10-13 |
| 9142459 | Wafer dicing using hybrid laser scribing and plasma etch approach with mask application by vacuum lamination | Prabhat Kumar, Wei-Sheng Lei, Ajay Kumar | 2015-09-22 |