Issued Patents All Time
Showing 25 most recent of 93 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12397370 | Pulse duration measuring apparatus | Koji Toyama, Nobuyuki Kimura, Koichi Katayama | 2025-08-26 |
| 12330266 | Polishing apparatus with thickness measuring unit | Kazuma Sekiya | 2025-06-17 |
| 12264908 | Measuring apparatus | — | 2025-04-01 |
| 12170225 | Laser processing method | Yuji HADANO | 2024-12-17 |
| 12121975 | Cutting machine | — | 2024-10-22 |
| 12097642 | Wafer producing method and wafer producing apparatus | — | 2024-09-24 |
| 11975401 | Detection device | — | 2024-05-07 |
| 11969916 | Wafer forming method | — | 2024-04-30 |
| 11938570 | Laser processing apparatus | — | 2024-03-26 |
| 11919114 | Measuring apparatus for measuring positional relation between a chuck table and a processing tool | — | 2024-03-05 |
| 11860097 | Measuring apparatus that measures height position or thickness of measurement-target object | Nobuyuki Kimura | 2024-01-02 |
| 11845158 | Thickness measuring apparatus | Nobuyuki Kimura | 2023-12-19 |
| 11839931 | Laser processing apparatus | — | 2023-12-12 |
| 11794277 | Detecting apparatus | — | 2023-10-24 |
| 11721584 | Wafer processing method including crushed layer and wafer processing apparatus | — | 2023-08-08 |
| 11679449 | Optical axis adjustment jig and method of confirming optical axis of laser processing apparatus | — | 2023-06-20 |
| 11565347 | Laser processing machine | Yuji HADANO | 2023-01-31 |
| 11538724 | Processing method of workpiece with laser power adjustment based on thickness measurement and processing apparatus thereof | — | 2022-12-27 |
| 11504804 | Method of confirming optical axis of laser processing apparatus | — | 2022-11-22 |
| 11361996 | Height detecting apparatus and laser processing apparatus | Taiki Sawabe, Nobuyuki Kimura | 2022-06-14 |
| 11325204 | Processing apparatus | — | 2022-05-10 |
| 11255657 | Image capturing apparatus with optical fiber located inside minute hole in objective lens | — | 2022-02-22 |
| 11224941 | Laser processing apparatus | Yuji HADANO, Masatoshi Nayuki | 2022-01-18 |
| 11168977 | Thickness measuring apparatus | Nobuyuki Kimura | 2021-11-09 |
| 11165408 | Method of manufacturing substrate for acoustic wave device | Jun Abatake, Kenya Kai, Kentaro Shiraga | 2021-11-02 |