Issued Patents All Time
Showing 51–75 of 93 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9130057 | Hybrid dicing process using a blade and laser | Prabhat Kumar, Wei-Sheng Lei, James S. Papanu, Ajay Kumar | 2015-09-08 |
| 9126285 | Laser and plasma etch wafer dicing using physically-removable mask | Wei-Sheng Lei, Saravjeet Singh, Madhava Rao Yalamanchili, Ajay Kumar | 2015-09-08 |
| 9129904 | Wafer dicing using pulse train laser with multiple-pulse bursts and plasma etch | Wei-Sheng Lei, Saravjeet Singh, Madhava Rao Yalamanchili, Ajay Kumar | 2015-09-08 |
| 9130030 | Baking tool for improved wafer coating process | Jungrae Park, Wei-Sheng Lei, James S. Papanu, Ajay Kumar | 2015-09-08 |
| 9130056 | Bi-layer wafer-level underfill mask for wafer dicing and approaches for performing wafer dicing | James M. Holden, James S. Papanu, Wei-Sheng Lei, Ajay Kumar | 2015-09-08 |
| 9112050 | Dicing tape thermal management by wafer frame support ring cooling during plasma dicing | Wei-Sheng Lei, Prabhat Kumar, Ajay Kumar | 2015-08-18 |
| 9105710 | Wafer dicing method for improving die packaging quality | Wei-Sheng Lei, Aparna Iyer, Madhava Rao Yalamanchili, Ajay Kumar, Jungrae Park | 2015-08-11 |
| 9093518 | Singulation of wafers having wafer-level underfill | Wei-Sheng Lei, James S. Papanu, Ajay Kumar | 2015-07-28 |
| 9076860 | Residue removal from singulated die sidewall | Wei-Sheng Lei, Prabhat Kumar, James S. Papanu, Ajay Kumar | 2015-07-07 |
| 9054176 | Multi-step and asymmetrically shaped laser beam scribing | Wei-Sheng Lei, Madhava Rao Yalamanchili, Saravjeet Singh, Ajay Kumar, James M. Holden | 2015-06-09 |
| 9048309 | Uniform masking for wafer dicing using laser and plasma etch | Mohammad Kamruzzaman Chowdhury, Wei-Sheng Lei, Todd Egan, Madhava Rao Yalamanchili, Ajay Kumar | 2015-06-02 |
| 9041198 | Maskless hybrid laser scribing and plasma etching wafer dicing process | Wei-Sheng Lei, James S. Papanu, Ajay Kumar | 2015-05-26 |
| 9018079 | Wafer dicing using hybrid laser scribing and plasma etch approach with intermediate reactive post mask-opening clean | Wei-Sheng Lei, Madhava Rao Yalamanchili, Ajay Kumar | 2015-04-28 |
| 9012305 | Wafer dicing using hybrid laser scribing and plasma etch approach with intermediate non-reactive post mask-opening clean | Wei-Sheng Lei, Jungrae Park, James S. Papanu, Ajay Kumar | 2015-04-21 |
| 8999816 | Pre-patterned dry laminate mask for wafer dicing processes | James M. Holden, Aparna Iyer, Ajay Kumar | 2015-04-07 |
| 8993414 | Laser scribing and plasma etch for high die break strength and clean sidewall | Saravjeet Singh, Wei-Sheng Lei, Madhava Rao Yalamanchili, Tong Liu, Ajay Kumar | 2015-03-31 |
| 8991329 | Wafer coating | Jungrae Park, Wei-Sheng Lei, Prabhat Kumar, James S. Papanu, Ajay Kumar | 2015-03-31 |
| 8980726 | Substrate dicing by laser ablation and plasma etch damage removal for ultra-thin wafers | Wei-Sheng Lei, Aparna Iyer, Madhava Rao Yalamanchili, Ajay Kumar | 2015-03-17 |
| 8980727 | Substrate patterning using hybrid laser scribing and plasma etching processing schemes | Wei-Sheng Lei, Ajay Kumar | 2015-03-17 |
| 8975163 | Laser-dominated laser scribing and plasma etch hybrid wafer dicing | Wei-Sheng Lei, James S. Papanu, Ajay Kumar | 2015-03-10 |
| 8975162 | Wafer dicing from wafer backside | Wei-Sheng Lei, Aparna Iyer, Saravjeet Singh, Madhava Rao Yalamanchili, Ajay Kumar | 2015-03-10 |
| 8969177 | Laser and plasma etch wafer dicing with a double sided UV-curable adhesive film | Mohammad Kamruzzaman Chowdhury, Wei-Sheng Lei, Todd Egan, Madhava Rao Yalamanchili, Ajay Kumar | 2015-03-03 |
| 8951819 | Wafer dicing using hybrid split-beam laser scribing process with plasma etch | Wei-Sheng Lei, Madhava Rao Yalamanchili, Saravjeet Singh, Ajay Kumar, Aparna Iyer | 2015-02-10 |
| 8946057 | Laser and plasma etch wafer dicing using UV-curable adhesive film | Wei-Sheng Lei, Mohammad Kamruzzaman Chowdhury, Todd Egan, Madhava Rao Yalamanchili, Ajay Kumar | 2015-02-03 |
| 8940619 | Method of diced wafer transportation | Wei-Sheng Lei, Aparna Iyer, Saravjeet Singh, Todd Egan, Ajay Kumar +1 more | 2015-01-27 |