Issued Patents All Time
Showing 1–25 of 39 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12131952 | Wafer dicing using femtosecond-based laser and plasma etch | Wei-Sheng Lei, Brad Eaton, Saravjeet Singh, Ajay Kumar, James M. Holden | 2024-10-29 |
| 11915932 | Plasma etching of mask materials | Toi Yue Becky Leung, Madhavi R. Chandrachood | 2024-02-27 |
| 11621194 | Wafer dicing using femtosecond-based laser and plasma etch | Wei-Sheng Lei, Brad Eaton, Saravjeet Singh, Ajay Kumar, James M. Holden | 2023-04-04 |
| 10910271 | Wafer dicing using femtosecond-based laser and plasma etch | Wei-Sheng Lei, Brad Eaton, Saravjeet Singh, Ajay Kumar, James M. Holden | 2021-02-02 |
| 10714390 | Wafer dicing using femtosecond-based laser and plasma etch | Wei-Sheng Lei, Brad Eaton, Saravjeet Singh, Ajay Kumar, James M. Holden | 2020-07-14 |
| 10566238 | Wafer dicing using femtosecond-based laser and plasma etch | Wei-Sheng Lei, Brad Eaton, Saravjeet Singh, Ajay Kumar, James M. Holden | 2020-02-18 |
| 10163713 | Wafer dicing using femtosecond-based laser and plasma etch | Wei-Sheng Lei, Brad Eaton, Saravjeet Singh, Ajay Kumar, James M. Holden | 2018-12-25 |
| 9620379 | Multi-layer mask including non-photodefinable laser energy absorbing layer for substrate dicing by laser and plasma etch | Wei-Sheng Lei, Mohammad Kamruzzaman Chowdhury, Todd Egan, Brad Eaton, Ajay Kumar | 2017-04-11 |
| 9263308 | Water soluble mask for substrate dicing by laser and plasma etch | Wei-Sheng Lei, Saravjeet Singh, Brad Eaton, Ajay Kumar | 2016-02-16 |
| 9252057 | Laser and plasma etch wafer dicing with partial pre-curing of UV release dicing tape for film frame wafer application | Mohammad Kamruzzaman Chowdhury, Wei-Sheng Lei, Todd Egan, Brad Eaton, Ajay Kumar | 2016-02-02 |
| 9245802 | Wafer dicing using femtosecond-based laser and plasma etch | Wei-Sheng Lei, Brad Eaton, Saravjeet Singh, Ajay Kumar, James M. Holden | 2016-01-26 |
| 9224625 | Laser and plasma etch wafer dicing using water-soluble die attach film | Wei-Sheng Lei, Brad Eaton, Saravjeet Singh, Ajay Kumar | 2015-12-29 |
| 9218992 | Hybrid laser and plasma etch wafer dicing using substrate carrier | Saravjeet Singh, Brad Eaton, Ajay Kumar, Wei-Sheng Lei, James M. Holden +1 more | 2015-12-22 |
| 9177864 | Method of coating water soluble mask for laser scribing and plasma etch | Wei-Sheng Lei, Brad Eaton, Aparna Iyer, Todd Egan, Ajay Kumar | 2015-11-03 |
| 9129904 | Wafer dicing using pulse train laser with multiple-pulse bursts and plasma etch | Wei-Sheng Lei, Saravjeet Singh, Brad Eaton, Ajay Kumar | 2015-09-08 |
| 9126285 | Laser and plasma etch wafer dicing using physically-removable mask | Wei-Sheng Lei, Saravjeet Singh, Brad Eaton, Ajay Kumar | 2015-09-08 |
| 9105710 | Wafer dicing method for improving die packaging quality | Wei-Sheng Lei, Brad Eaton, Aparna Iyer, Ajay Kumar, Jungrae Park | 2015-08-11 |
| 9054176 | Multi-step and asymmetrically shaped laser beam scribing | Wei-Sheng Lei, Brad Eaton, Saravjeet Singh, Ajay Kumar, James M. Holden | 2015-06-09 |
| 9048309 | Uniform masking for wafer dicing using laser and plasma etch | Mohammad Kamruzzaman Chowdhury, Wei-Sheng Lei, Todd Egan, Brad Eaton, Ajay Kumar | 2015-06-02 |
| 9023227 | Increased deposition efficiency and higher chamber conductance with source power increase in an inductively coupled plasma (ICP) chamber | Jivko Dinev, Saravjeet Singh, Khalid Mohiuddin Sirajuddin, Tong Liu, Puneet Bajaj +3 more | 2015-05-05 |
| 9018079 | Wafer dicing using hybrid laser scribing and plasma etch approach with intermediate reactive post mask-opening clean | Wei-Sheng Lei, Brad Eaton, Ajay Kumar | 2015-04-28 |
| 8993414 | Laser scribing and plasma etch for high die break strength and clean sidewall | Brad Eaton, Saravjeet Singh, Wei-Sheng Lei, Tong Liu, Ajay Kumar | 2015-03-31 |
| 8980726 | Substrate dicing by laser ablation and plasma etch damage removal for ultra-thin wafers | Wei-Sheng Lei, Aparna Iyer, Brad Eaton, Ajay Kumar | 2015-03-17 |
| 8975162 | Wafer dicing from wafer backside | Wei-Sheng Lei, Brad Eaton, Aparna Iyer, Saravjeet Singh, Ajay Kumar | 2015-03-10 |
| 8969177 | Laser and plasma etch wafer dicing with a double sided UV-curable adhesive film | Mohammad Kamruzzaman Chowdhury, Wei-Sheng Lei, Todd Egan, Brad Eaton, Ajay Kumar | 2015-03-03 |