AI

Aparna Iyer

Applied Materials: 15 patents #903 of 7,310Top 15%
Overall (All Time): #294,613 of 4,157,543Top 8%
16
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
11195756 Proximity contact cover ring for plasma dicing James M. Holden, Alexander Lerner, Ajay Kumar, Alan Ouye 2021-12-07
10692765 Transfer arm for film frame substrate handling during plasma singulation of wafers James M. Holden, Alexander Lerner, Ajay Kumar, Brad Eaton 2020-06-23
9343366 Dicing wafers having solder bumps on wafer backside Wei-Sheng Lei, James S. Papanu, Brad Eaton, Ajay Kumar 2016-05-17
9299614 Method and carrier for dicing a wafer James M. Holden, Brad Eaton, Ajay Kumar 2016-03-29
9275902 Dicing processes for thin wafers with bumps on wafer backside Wei-Sheng Lei, James S. Papanu, Brad Eaton, Ajay Kumar 2016-03-01
9236305 Wafer dicing with etch chamber shield ring for film frame wafer applications Wei-Sheng Lei, Saravjeet Singh, Jivko Dinev, Brad Eaton, Ajay Kumar 2016-01-12
9177864 Method of coating water soluble mask for laser scribing and plasma etch Wei-Sheng Lei, Brad Eaton, Todd Egan, Madhava Rao Yalamanchili, Ajay Kumar 2015-11-03
9105710 Wafer dicing method for improving die packaging quality Wei-Sheng Lei, Brad Eaton, Madhava Rao Yalamanchili, Ajay Kumar, Jungrae Park 2015-08-11
8999816 Pre-patterned dry laminate mask for wafer dicing processes James M. Holden, Brad Eaton, Ajay Kumar 2015-04-07
8980726 Substrate dicing by laser ablation and plasma etch damage removal for ultra-thin wafers Wei-Sheng Lei, Brad Eaton, Madhava Rao Yalamanchili, Ajay Kumar 2015-03-17
8975162 Wafer dicing from wafer backside Wei-Sheng Lei, Brad Eaton, Saravjeet Singh, Madhava Rao Yalamanchili, Ajay Kumar 2015-03-10
8951819 Wafer dicing using hybrid split-beam laser scribing process with plasma etch Wei-Sheng Lei, Brad Eaton, Madhava Rao Yalamanchili, Saravjeet Singh, Ajay Kumar 2015-02-10
8940619 Method of diced wafer transportation Wei-Sheng Lei, Brad Eaton, Saravjeet Singh, Todd Egan, Ajay Kumar +1 more 2015-01-27
8912078 Dicing wafers having solder bumps on wafer backside Wei-Sheng Lei, James S. Papanu, Brad Eaton, Ajay Kumar 2014-12-16
8877119 Method of synthesizing multi-phase oxide ceramics with small phase domain sizes Eric Jordan, Steven L. Suib, Jacquelynn K M Garofano, Chun-Hu Chen 2014-11-04
8859397 Method of coating water soluble mask for laser scribing and plasma etch Wei-Sheng Lei, Brad Eaton, Todd Egan, Madhava Rao Yalamanchili, Ajay Kumar 2014-10-14